Thermal Design Engineer
Volantis SemiconductorJob Title
Thermal Design Engineer
Role Summary
Design and deliver the cooling system for a photonic wafer-scale system, addressing novel thermomechanical and high power-density challenges. Work with cross-functional teams (mechanical, electrical, packaging, and systems) to develop, validate, and iterate thermal solutions.
Experience Level
Mid-level. Specific years of experience not stated.
Responsibilities
Primary responsibilities center on defining and implementing thermal solutions for large-format, high-power photonic systems.
- Design liquid-cooled thermal systems and cooling architecture for wafer-scale photonic hardware.
- Analyze thermal bottlenecks in high-power-density assemblies and propose mitigations.
- Develop thermal models and simulations; validate with test hardware and measurements.
- Collaborate with mechanical, electrical, and packaging teams to integrate cooling solutions into product designs.
- Iterate on prototypes and manufacturing approaches to meet reliability and performance targets.
Requirements
Must-have experience and technical capabilities required to perform the role.
- Experience with liquid-cooled systems.
- Experience with higher TDP and high power-density systems.
- Deep understanding of thermal bottlenecks in high power dissipation and high power-density environments.
- Proven ability to innovate and solve non-incremental thermal and thermomechanical problems.
Nice-to-have:
- Experience where the TIM (thermal interface material) is the primary performance bottleneck.
- Familiarity with advanced or emerging TIM materials and multi-TIM systems.
- Experience with cooling challenges for large-physical-size IC advanced package assemblies.
- Experience with rack-scale system cooling.
Education Requirements
Not specified.
About the Company
Company: Volantis Semiconductor
Semiconductor hardware startup developing wafer-scale heterogeneous packages that integrate silicon and compound semiconductor dies for high-TDP AI platforms. Focus areas include advanced packaging design and process development, interposer technologies, thermal/mechanical challenges, and system co-design.
