Power Delivery System Engineer
Volantis SemiconductorJob Title
Power Delivery System Engineer
Role Summary
Design the power delivery subsystem for Volantis wafer-scale A-0 and A-1 systems, focusing on meeting system-level power density and power-integrity requirements while ensuring high-volume manufacturability and mechanical stability. Work across SoC, PCB, mechanical, and manufacturing teams to deliver robust, testable power solutions.
Experience Level
Mid-level. No specific years-of-experience guidance provided.
Responsibilities
Primary responsibilities include:
- Architect and design system-level power delivery for wafer-scale systems (A-0 and A-1).
- Develop VRM topologies and implement vertical power delivery to meet high power-density targets.
- Perform power-integrity analysis and simulations at the system and board level.
- Select components and design for manufacturability, mechanical stability, and thermal constraints.
- Lead lab bring-up, validation, and debugging of power subsystems.
- Collaborate with SoC, board, mechanical, and supply-chain teams; document architecture and implementation decisions.
Requirements
Key requirements and preferred skills.
- Must-have: Experience with high power density VRM systems.
- Must-have: Experience designing power delivery subsystems for high-TDP and high power-density SoCs and PCBs.
- Practical knowledge of power-integrity analysis and system-level power architecture.
- Hands-on experience with lab bring-up and validation of power delivery subsystems.
Nice-to-have:
- Experience with resonant VRMs.
- Experience with vertical power delivery systems and advanced or tightly packaged magnetics.
- Experience designing custom VRMs and integrating products from vendors such as Vicor and MPS.
- Experience with low-voltage, high-current draw systems.
Education Requirements
Not specified.
About the Company
Company: Volantis Semiconductor
Semiconductor hardware startup developing wafer-scale heterogeneous packages that integrate silicon and compound semiconductor dies for high-TDP AI platforms. Focus areas include advanced packaging design and process development, interposer technologies, thermal/mechanical challenges, and system co-design.
