PIC Design Engineer
Volantis SemiconductorJob Title
PIC Design Engineer
Role Summary
Design and own aspects of wafer-scale photonic interposer PICs, focusing on device-level and system-level trade-offs between density and manufacturability. Work with process, test, and layout teams to deliver large-device-count tapeouts and improve yield on large-area wafers.
Experience Level
Mid-level. The posting expects demonstrated PIC design and tapeout experience but does not state a specific number of years.
Responsibilities
Primary responsibilities include hands-on PIC design, problem solving for manufacturability and yield, and collaboration across disciplines.
- Develop and own designs for wafer-scale photonic interposer PIC components (passive and active).
- Balance density, performance, and manufacturability in layout and architecture decisions.
- Analyze and mitigate the impact of process variation on large-area wafers.
- Design for low-loss optical coupling in and out of the PIC under realistic alignment and manufacturing conditions.
- Collaborate with fabrication, test, packaging, and integration teams to support tapeouts and debug issues.
Requirements
Must-have technical skills and experience are listed first; followed by desirable qualifications.
- Experience with both passive and active PIC design components.
- Deep understanding of the underlying physics of PIC devices (not just simulation workflow).
- Proven experience with large-device-count PIC tapeouts.
- Expertise in optical coupling strategies to achieve very low losses under realistic manufacturing and alignment tolerances.
- Familiarity with physical manufacturing processes for PICs.
Nice-to-have:
- Experience with high-speed optical communications PICs.
- Experience designing on non-silicon-photonics platforms (InP, TFLN, SiN, polymers, glass).
- Knowledge of active gain-chip integration (integrated lasers, SOAs, etc.).
- Experience with large-area PICs and statistical process control / sources of process variation.
Education Requirements
Not specified.
About the Company
Company: Volantis Semiconductor
Semiconductor hardware startup developing wafer-scale heterogeneous packages that integrate silicon and compound semiconductor dies for high-TDP AI platforms. Focus areas include advanced packaging design and process development, interposer technologies, thermal/mechanical challenges, and system co-design.
