Photonics Packaging Engineer
Volantis SemiconductorJob Title
Photonics Packaging Engineer
Role Summary
Engineer responsible for contributing to and owning aspects of A-0 and A-1 photonics packages. The role sits between photonics and advanced packaging disciplines and focuses on integrating multiple dies and heterogeneous materials into manufacturable package assemblies.
Experience Level
Mid-level. No specific years of experience provided.
Responsibilities
Primary responsibilities include ownership of package elements and technical integration between photonics and packaging teams.
- Contribute to and own aspects of A-0 and A-1 package designs and implementations.
- Integrate multiple dies into photonics package assemblies.
- Work across photonics and advanced packaging disciplines to resolve design and manufacturing trade-offs.
- Apply photonics concepts (mode field, mode mismatch, polarization) to packaging decisions.
- Collaborate with cross-functional teams to ensure manufacturable, testable assemblies.
Requirements
Must-have technical background and preferred skills are listed below.
- Must-have: Experience with integrated photonics package assemblies involving multiple dies.
- Experience with integrated circuit MCM assemblies containing multiple heterogeneous materials, including compound semiconductors.
- Working understanding of photonics concepts such as mode field diameters, mode mismatch, and polarization.
- Nice-to-have: Experience with large device-count photonic assemblies.
- Experience with clear underfill and high-density fiber attachment techniques.
- Experience with large-substrate photonic MCM assemblies and hands-on PIC design.
Education Requirements
Not specified.
About the Company
Company: Volantis Semiconductor
Semiconductor hardware startup developing wafer-scale heterogeneous packages that integrate silicon and compound semiconductor dies for high-TDP AI platforms. Focus areas include advanced packaging design and process development, interposer technologies, thermal/mechanical challenges, and system co-design.
