Packaging Engineering Intern - Winter
fab2Job Title
Packaging Engineering Intern - Winter
Role Summary
Hands-on engineering internship on a small semiconductor packaging team focused on process development and integration for packaging fabrication. Work includes mechanical prototyping, experiment design, and data analysis across packaging processes and equipment.
Preferred commitment 4–8 months beginning in January; role emphasizes rapid iteration and building testable prototypes.
Experience Level
Entry-level (Internship). Preferred commitment 4–8 months starting in January.
Responsibilities
Work on design, assembly, and process development for packaging equipment and wafer/package processing.
- Design and iterate machines and subsystems (e.g., laser ablation, reflow ovens, automated plating systems).
- Integrate mechanical, electrical, and optical components; perform wiring and optics alignment.
- Execute hands-on package and wafer processing: 3D printing, metal plating, lithography, metrology.
- Develop experiments, collect and analyze data, and rapidly iterate on designs and processes.
- Collaborate with cross-functional team members to improve fabrication processes and equipment.
Requirements
Key qualifications and skills. A portfolio showing physical projects or shipped systems is required.
Must-have
- At least 1–2 hands-on wet-lab or lab-adjacent experiences (ideally metal plating or device fabrication).
- Strong foundation in mechanical engineering concepts and CAD (SolidWorks, Onshape, materials selection).
- Hands-on prototyping experience and ability to move through design cycles quickly.
- Ability to work safely with lab equipment and follow experimental procedures.
Nice-to-have
- Mechatronics or electromechanical system design experience.
- Familiarity with lasering and stereolithography 3D printing.
- Reliability testing, soldering, and reflow experience.
- Experience with nano-fabrication or metrology tools (etching, deposition, SEM, thin film measurement, X-ray).
Education Requirements
Pursuing a Bachelor’s degree or higher in engineering. (The posting specifies enrollment in an engineering degree program.)
About the Company
Company: fab2
Headquarters: Austin, TX, United States
Early-stage hardware startup that designs and builds semiconductor fabrication equipment, tools, and the hardware/software needed to make fabs. Works on lithography, metrology, motion systems and related components; founded by Sam Zeloof and Jim Keller with offices in Austin and San Francisco.
