Packaging Engineering Intern - Summer
fab2Job Title
Packaging Engineering Intern - Summer
Role Summary
Hands-on summer internship on a small hardware team developing semiconductor packaging processes. The role focuses on mechanical prototyping, experiment design, process integration, and data analysis across packaging equipment and metrology tools.
Preferred start in May or June with a 4–8 month commitment. A portfolio of built projects is required.
Experience Level
Entry-level internship. Suitable for students or early-career engineers; recommended 1–2 hands-on lab or lab-adjacent experiences (e.g., metal plating or device fabrication). Preferred commitment: 4–8 months.
Responsibilities
Primary responsibilities include hands-on engineering, system integration, and process development for semiconductor packaging.
- Design and iterate machines and subsystems for packaging fabrication (laser ablation, reflow ovens, automated plating).
- Integrate mechanical, electrical, and optical components; assemble systems and wire electronics.
- Perform hands-on package and wafer processing: 3D printing, metal plating, lithography, metrology.
- Collaborate with cross-functional teams to improve fabrication processes and equipment.
- Design experiments, collect data, and analyze results to inform rapid iterations.
Requirements
Must-have skills and practical experience for this internship.
- At least 1–2 hands-on wet lab or lab-adjacent experiences (metal plating or device fabrication preferred).
- Strong foundation in mechanical engineering tools and concepts (SolidWorks/Onshape, materials selection).
- Hands-on prototyping experience and the ability to move through design cycles quickly.
- Experience using or willingness to learn fabrication tools: 3D printers (SLA), lasers, plating equipment, and metrology instruments.
- Ability to work safely in lab environments and comply with U.S. export-control requirements when applicable.
Nice-to-have:
- Mechatronics or electromechanical system design experience.
- Familiarity with lasering, stereolithography 3D printing, soldering, and reflow testing.
- Experience with nanofabrication tools (etching, deposition, patterning) and metrology (SEM, X-ray, thin-film measurement).
Education Requirements
Pursuing a Bachelor's degree or higher in engineering (mechanical, electrical, materials, or related fields).
About the Company
Company: fab2
Headquarters: Austin, TX, United States
Early-stage hardware startup that designs and builds semiconductor fabrication equipment, tools, and the hardware/software needed to make fabs. Works on lithography, metrology, motion systems and related components; founded by Sam Zeloof and Jim Keller with offices in Austin and San Francisco.
