Mechanical Design Engineer

Job Title

Mechanical Design Engineer

Role Summary

Design and own aspects of wafer-scale mechanical assemblies for high-power compute systems, focusing on interactions among power delivery, chassis, heatsink and related components. Collaborate with electrical, thermal, and manufacturing teams in a hybrid engineering environment.

Experience Level

Mid-level

Responsibilities

Primary responsibilities include:

• Develop mechanical designs for wafer-scale assemblies, trays, chassis, and heatsinks.
• Define and validate interactions between power delivery, mechanical structure, and thermal management.
• Perform thermal and structural analysis (FEA), tolerance stackups, and CTE-mismatch mitigation.
• Produce CAD models, detailed drawings, and BOMs; support DFM and supplier engagement.
• Lead prototyping, test plans, and failure-analysis activities.
• Collaborate with electrical, thermal, and manufacturing teams to integrate mechanical solutions.

Requirements

Must-have and preferred qualifications:

• Proven track record solving challenging mechanical engineering problems with novel solutions.
• Experience with high power-density compute trays, chassis, or rack-level systems.
• Experience designing multi-material assemblies with mismatched coefficients of thermal expansion (CTEs).
• Proficiency with mechanical CAD and analysis tools; experience with FEA and thermal modeling.
• Strong documentation skills: drawings, specifications, and BOMs; experience with DFM and supplier interaction.
• Nice-to-have: solder joint reliability, large IC package/assembly experience, CoWoS package assemblies, optical-system assemblies, or liquid-cooled mechanical designs.

Education Requirements

Not specified.

About the Company

Company: Volantis Semiconductor

Semiconductor hardware startup developing wafer-scale heterogeneous packages that integrate silicon and compound semiconductor dies for high-TDP AI platforms. Focus areas include advanced packaging design and process development, interposer technologies, thermal/mechanical challenges, and system co-design.