IO Module Engineer

Job Title

IO Module Engineer

Role Summary

Design, validate, and support assembly and bring-up of IO modules that attach to A-0 and A-1 wafers. Work spans thermomechanical, electrical and mechanical engineering to ensure signal integrity and reliable connectorized interfaces.

Experience Level

Mid-level. The posting does not specify years of experience.

Responsibilities

Key responsibilities include:

• Design and iterate thermomechanical and mechanical aspects of IO modules and their assemblies.
• Perform signal integrity signoff and validation for copper and electro‑optic connector interfaces.
• Develop and execute bring-up plans for connectorized links and systems.
• Collaborate with packaging, test, and manufacturing teams to ensure assembly reliability and manufacturability.
• Troubleshoot mechanical and electrical issues during prototype and production bring-up.

Requirements

Must-have skills and experience:

• Hands-on experience with signal integrity analysis and signoff for copper and electro‑optic connector interfaces.
• Practical mechanical experience with electrical and electro‑optic connectors.
• Experience bringing up connectorized links and systems in a lab or production environment.

Nice-to-have:

• Experience with sockets and socketed connectors.
• Experience with co‑packaged copper and co‑packaged optics.
• Familiarity with high-density optical modules and XPO optical pluggable form factors.

Education Requirements

Not specified.

About the Company

Company: Volantis Semiconductor

Semiconductor hardware startup developing wafer-scale heterogeneous packages that integrate silicon and compound semiconductor dies for high-TDP AI platforms. Focus areas include advanced packaging design and process development, interposer technologies, thermal/mechanical challenges, and system co-design.