IC Packaging Design Engineer

Job Title

IC Packaging Design Engineer

Role Summary

Design IC packaging and substrate layouts for a new product development project. Work on signal- and power-integrity-aware substrate designs, collaborate with cross-functional teams, and optimize designs for performance, manufacturability, yield, and reliability.

Experience Level

Mid-level. Years of experience not specified; the role requires proven experience in IC package design.

Responsibilities

Primary responsibilities include package and substrate design, verification, and cross-team coordination.

• Design and implement IC packaging solutions for new products.
• Develop substrate design and layout with SI/PI-aware practices.
• Ensure design compliance with industry standards and internal specifications.
• Collaborate with electrical, mechanical, and manufacturing teams to optimize performance and manufacturability.
• Evaluate and enhance designs for yield and reliability.

Requirements

Key technical skills and hands-on experience required. See Education Requirements below for degree expectations.

• Proven, hands-on experience in IC package design.
• Proficiency with Siemens (Mentor) Xpedition (XPD) or Cadence Allegro / Advanced Package Designer (APD/SIP).
• Expertise in physical design and layout for IC packages.
• Knowledge of design rule compliance and packaging best practices.

Education Requirements

Bachelor's or Master's degree in Electrical or Electronics Engineering (as specified in the source).

About the Company

Company: Scalable Systems

Headquarters: Chandler, AZ, United States

Chandler-based engineering company focused on electronics and semiconductor product development, including IC packaging design, substrate layout, and manufacturing-aware physical design for new products.