Advanced Packaging Lead

Job Title

Advanced Packaging Lead

Role Summary

Lead the development of back-end fabrication and assembly technologies for QuantWare's multi-layer quantum processor chip stack, with a focus on flip-chip bonding, contact reliability, and manufacturability. You will define process-development projects, design experiments, and ensure seamless integration across teams to support scalable system growth.

Experience Level

Senior-level. Guidance: 4+ years in chip assembly development or related deep-tech/low-volume technology.

Responsibilities

Core responsibilities include planning and executing assembly process development, coordinating integration tests, and formalising reproducible procedures for scaling.

• Plan and lead development of back-end fabrication and assembly technologies focusing on flip-chip bonding, contact reliability, and manufacturability for the multi-layer chip stack.
• Define and execute process-development projects and design of experiments (DoE).
• Develop and coordinate integration test plans with cross-functional engineering teams.
• Establish scalable, well-documented assembly and integration procedures to support system growth.
• Investigate and resolve integration issues and technical anomalies to meet specifications and performance targets.
• Drive continuous improvement and transfer of processes toward higher yield and reliability.

Requirements

Must-have technical skills and experience; nice-to-have items listed separately.

• Minimum 4+ years experience in chip assembly development for deep-tech or low-volume manufacturing.
• Hands-on experience with back-end process-flow development: UBM, hard-stops, bumps, detachable contacts / MEMS, and flip-chip technologies.
• Proven ability to plan and execute process development projects and DoE.
• Experience coordinating integration testing and working with cross-functional teams (fabrication, test, design).
• Strong problem-solving and debugging skills in assembly and integration contexts.
• Nice-to-have: experience with MEMS contacts and leading cross-functional technical projects; familiarity with low-volume manufacturing scale-up.
• Nice-to-have: background in superconducting qubits.

Education Requirements

Preferred degree in physics, microwave/RF/electrical engineering, or a related technical field. PhD is a plus.

About the Company

Company: QuantWare

Headquarters: Delft, Netherlands

QuantWare develops superconducting quantum processors using its VIO™ QPU architecture to enable scalable, high‑qubit quantum computers. The company focuses on qubit chip design, cryogenic readout, and modular QPU architectures to advance performance and manufacturability.