Advanced Packaging Engineer
Volantis SemiconductorJob Title
Advanced Packaging Engineer
Role Summary
Work on the Volantis A-0 and A-1 wafer-scale package, contributing to package design and/or package process development for heterogeneous silicon and compound-semiconductor dies at high TDP. The role focuses on addressing warpage, CTE mismatch, thermomechanical behavior, assembly speed, and large-scale substrate challenges.
Collaborate with architects and cross-functional teams to co-design system and package solutions that enable high-bandwidth, high-performance AI platforms.
Experience Level
Mid-level — expected to have relevant industry experience in package design or package process development. (No specific years provided.)
Responsibilities
Primary responsibilities include design, development, and validation of advanced packaging solutions and processes.
- Contribute to and own aspects of A-0 and A-1 package architecture and implementation.
- Design and/or develop package processes for large-scale, high-TDP assemblies.
- Analyze and mitigate warpage, CTE mismatch, and thermomechanical risks.
- Define assembly flows (e.g., flip-chip, mass reflow) and evaluate manufacturability and yield.
- Prototype, test, and iterate on substrates, interposers, and heterogeneous material stacks.
- Work with system architects to co-design package and system-level solutions.
Requirements
Must-have technical capabilities and problem-solving approach.
- Demonstrated experience in design or process development of complex packages.
- Ability to reason from first principles and apply novel solutions to unique packaging challenges.
Nice to have:
- Experience with heterogeneous material assemblies (silicon + compound semiconductors).
- Background in high-TDP package design and thermal management.
- Experience with compound semiconductor assemblies or co-packaged optics.
- Familiarity with interposer platforms (CoWoS, EMIB, FoCoS, FoCoS-Bridge, etc.).
- Experience with flip-chip integration, mass reflow, TCB & LAB processes.
- Experience with large-scale substrates (>50x50 mm).
Education Requirements
Not specified.
About the Company
Company: Volantis Semiconductor
Semiconductor hardware startup developing wafer-scale heterogeneous packages that integrate silicon and compound semiconductor dies for high-TDP AI platforms. Focus areas include advanced packaging design and process development, interposer technologies, thermal/mechanical challenges, and system co-design.
