Yield Development Engineer

Job Title

Yield Development Engineer

Role Summary

Responsible for driving yield improvement activities for Advanced Packaging Technology and Manufacturing (APTM) packaging technologies. Works with process modules, integration, and cross-functional stakeholders to analyze manufacturing data, define yield roadmaps, and deploy corrective and preventative actions.

Uses data analytics and model-based problem solving to extract insights from inline tool data, metrology images, electrical test results, and lab characterization; prepares reports and communicates recommendations to stakeholders.

Experience Level

Mid-level — typical experience expectation is several years of hands-on manufacturing or data-analytics work (see Education Requirements for degree-to-experience combinations).

Responsibilities

Core responsibilities include monitoring and improving yield across packaging processes and collaborating with stakeholders to resolve yield issues.

• Define and execute yield improvement roadmaps; lead yield working groups or taskforces.
• Analyze multiple data sources (inline tool data, metrology images, electrical test, lab characterization) to identify root causes of yield loss.
• Develop data-driven hypotheses and model-based problem solving approaches linking analysis to process fundamentals and tool behavior.
• Prepare and present yield reports, communicate key findings and recommended next steps to stakeholders and leadership.
• Monitor daily yield metrics, respond to yield loss events, and implement proactive/preventative measures.

Requirements

Must-have technical skills and experience (degrees are listed under Education Requirements).

• Must-have: Hands-on experience with data analytics using Python and/or JMP; familiarity with common Python data-science libraries (NumPy, Pandas, SciPy, Matplotlib, scikit-learn, TensorFlow/PyTorch).
• Must-have: Experience extracting insights from manufacturing data sources and translating analysis into actionable process improvements.
• Must-have: Strong problem-solving skills and ability to build hypothesis-driven models and test plans.
• Nice-to-have: Prior experience with wafer-level or package assembly processes, tools, and common yield issues.
• Nice-to-have: Experience leading cross-functional teams, running working groups or taskforces, and driving technical resolution across organizations.
• Professional: Effective verbal and written communication, self-driven, able to work in fast-paced and ambiguous environments.

Education Requirements

Degree and experience combinations required: Bachelor's degree plus 3+ years of relevant experience, Master's degree plus 2+ years of relevant experience, or Ph.D. in Physics, Mechanical Engineering, Materials Science, Electrical Engineering, Chemistry, or a related STEM field (other relevant STEM degrees considered).

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.