YE Physical Failure Analysis Engineering Intern
Intern on the Technology Development Yield Enhancement (YE) team focused on Physical Failure Analysis (PFA) for memory devices. The role provides hands-on exposure to failure analysis techniques used to confirm physical failures and improve manufacturing yield.
The intern will be assigned a project to develop problem‑solving skills, learn device processes and operation, and contribute actionable feedback for process improvement.
Entry-level internship: suitable for first‑year to junior students in a 4‑year bachelor's program or students graduating by spring 2027.
Key tasks you will perform during the internship:
Must-have and preferred skills for success in this internship.
Enrolled in a bachelor's degree program (4-year) in Electrical Engineering, Electronics Engineering, Materials Science and Engineering, Physics, Chemistry, or Chemical Engineering. Eligible applicants include first‑year through junior students, or students graduating by spring 2027.
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
