WireBond Engineer (ASM)

Job Title

WireBond Engineer (ASM)

Role Summary

Responsible for end-to-end ownership of Die Attach and Wire Bond process and equipment performance on a Reel-to-Reel (R2R) semiconductor assembly line. The role focuses on ensuring equipment uptime, process stability, yield improvement and quality in high-volume manufacturing.

Experience Level

Entry-level (2–3 years of relevant hands-on semiconductor backend experience).

Responsibilities

Key day-to-day responsibilities and ownership areas.

• Own and sustain Die Attach and Wire Bond processes and equipment to meet OEE and process specifications.
• Manage tooling setup, calibration, alignment and qualification.
• Provide daily process and equipment support to production for smooth operations and lot transitions.
• Perform DOE, FMEA and root-cause analysis for yield and quality issues (e.g., die tilt, voids, ball offset, wire lift).
• Optimize bonding parameters and validate process capability (Cpk) for products.
• Lead NPI activities including setup, conversion and buy-off for new products and materials.
• Analyze equipment and process data (UPH, yield, downtime, alarms) using Spotfire, Power BI, Excel or equivalent tools.
• Drive continuous improvement and cost-reduction projects to improve productivity and reduce scrap.
• Implement digital controls and interlocks (recipe management, alarm limits, auto-locks) to prevent errors.
• Document SOPs, provide technical training to technicians/operators and report performance metrics to management.

Requirements

Must-have technical skills and experience.

• 2–3 years of hands-on experience supporting Die Bond and/or Wire Bond in semiconductor backend manufacturing.
• Practical knowledge of Reel-to-Reel (R2R) assembly lines and high-volume production.
• Hands-on experience with equipment setup, calibration, troubleshooting and optimization.
• Familiarity with DOE, FMEA, SPC, 8D and structured problem-solving methods.
• Ability to analyze manufacturing data using Excel, Spotfire, Power BI or similar tools.
• Understanding of OEE, yield improvement and process capability (Cpk).
• Experience supporting NPI, product conversion and material qualification.
• Strong communication and cross-functional collaboration skills; detail-oriented and self-motivated.

Education Requirements

Bachelor's degree in Engineering (Mechanical, Electrical, Electronics, Mechatronics or related discipline) is specified.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.