Senior Engineer (WB/DB)

Job Title

Senior Engineer (WB/DB)

Role Summary

Responsible for end-to-end ownership of Die Attach and Wire Bond process and equipment performance on a Reel-to-Reel semiconductor assembly line. The role focuses on ensuring equipment uptime, process stability, yield improvement and quality in high-volume manufacturing.

The engineer provides hands-on technical support, leads continuous improvement and supports new product introductions in collaboration with QA, Production and Engineering teams.

Experience Level

Senior level. The role targets experienced engineers with demonstrated production support background (typical posting guidance: 5–7 years in Die Bond and/or Wire Bond within semiconductor backend manufacturing).

Responsibilities

Primary duties include process and equipment ownership, problem solving, data analysis and continuous improvement to meet production and quality targets.

• Own and sustain die attach and wire bond processes and equipment to meet OEE and process specifications.
• Manage tooling setup, calibration, alignment and qualification activities.
• Provide daily process and equipment support for production lines and lot transitions.
• Conduct DOE, FMEA and root-cause analysis for yield and quality issues (e.g., die tilt, voids, ball offset, wire lift).
• Optimize bonding parameters and validate process capability (Cpk) for new and existing products.
• Lead new product introduction (NPI) tasks: setup, conversion and buy-off for new products and material changes.
• Analyze equipment and process data (UPH, yield, downtime, alarms) using Spotfire, Power BI, Excel or similar tools.
• Drive continuous improvement and cost-reduction projects to improve productivity and reduce scrap.
• Implement digital controls and interlocks (recipe management, alarm limits, auto-locks) to prevent errors.
• Document SOPs, provide technical training and present regular reports on yield and performance.

Requirements

Must-have technical skills and production experience for reliable process and equipment support.

• Hands-on experience supporting Die Attach and/or Wire Bond equipment in semiconductor backend manufacturing and familiarity with R2R assembly lines.
• Proven capability in equipment setup, calibration, troubleshooting and optimization.
• Practical use of DOE, FMEA, SPC, 8D and structured problem-solving methods.
• Ability to analyze manufacturing data using Excel, Spotfire, Power BI or similar tools.
• Solid understanding of OEE, yield improvement and process capability (Cpk).
• Experience supporting NPI, product conversion and material qualification.
• Strong communication skills and ability to work cross-functionally; self-motivated and detail-oriented.
• Nice-to-have: experience implementing digital interlocks, recipe management systems and alarm-based controls.

Education Requirements

Bachelor's degree in engineering (Mechanical, Electrical, Electronics, Mechatronics or related discipline) as stated in the source posting.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.