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Wire Bonding Development Engineer (Semiconductor Assembly)

Renesas
October 23, 2026
Full-time
On-site
Yonezawa, Yamagata, Japan
Process Engineering Jobs, Level - Entry or Early Career

Job Title

Wire Bonding Development Engineer (Semiconductor Assembly)

Role Summary

Responsible for developing and qualifying wire-bonding processes for new semiconductor assembly products, supporting mass-production transfer, and improving yield and quality.

Works in the engineering department and coordinates technical activities with overseas manufacturing sites.

Experience Level

Entry-level / Early career - minimum 1 year of relevant production engineering or development experience in semiconductor back-end (wire bonding).

Responsibilities

Primary duties include process development, documentation, problem resolution, and cross-site technical coordination.

  • Establish wire-bonding process conditions and develop related technologies for new products.
  • Provide technical support for project development and produce technical reports.
  • Prepare and maintain specifications for transfer to mass production.
  • Drive yield and quality improvement activities for new products.
  • Evaluate and implement new materials and process methods.
  • Coordinate technical activities with overseas sites.

Requirements

Required and preferred skills and experience.

  • Must-have: At least 1 year of production engineering or development experience in semiconductor back-end wire-bonding.
  • Must-have: Basic knowledge of reliability testing and semiconductor back-end processes.
  • Must-have: Japanese: business level; English: conversational (approximately TOEIC 500).
  • Nice-to-have: Experience in development of semiconductor package materials (wire, die-attach materials).
  • Nice-to-have: Experience with process technology ramp-up and defect improvement in wire-bonding.
  • Nice-to-have: Experience creating drawings using CAD.

Education Requirements

Technical degree required: bachelor's (or equivalent) in mechanical, materials, electronics/electrical, chemical engineering or a related technical field.


About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.

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Date Posted: 2026-10-07