Senior Staff Packaging Product Engineer

Job Title

Senior Staff Packaging Product Engineer

Role Summary

Senior technical contributor responsible for design, development and issue resolution of advanced high-power semiconductor packages. Works cross-functionally with design, assembly, test, reliability, quality, sales and external OSAT suppliers to deliver reliable, low-cost, mass-producible solutions.

Experience Level

Senior-level - minimum 15 years of experience in semiconductor packaging technology.

Responsibilities

Accountable for package design, process definition, qualification and transfer to production for advanced power packages.

• Design and develop advanced high-power discrete, multi-chip, stacked and module packages.
• Define package design rules, process flows, BOMs and material sets for new products, including automotive packages.
• Analyze thermal, mechanical and electrical performance; assess stress and electro-chemical interactions.
• Plan and run DOE to establish process windows and material characteristics.
• Resolve reliability and assembly issues with OSATs to meet yield, quality and customer requirements.
• Define and drive reliability testing and qualifications per JEDEC/AEC and automotive standards.
• Manage technical projects: timelines, material readiness, manufacturability and reporting.
• Transfer NPI knowledge to sustaining teams and drive continuous improvement in yield, cost and cycle time.
• Collaborate on packaging roadmap aligned to product strategy and revenue targets.

Requirements

Must-have technical skills, hands-on experience and leadership in packaging process development and vendor management.

• 15+ years in semiconductor packaging technology with hands-on process and package development experience.
• Practical experience with power discrete products: multi-die/stacked die configurations, Ag sintered die bonding, Al and Cu/PCC bonding, Cu clip, flip-chip LGA and QFN technologies.
• Experience with material and process technologies: die attach films, Ag sintered epoxies, clip/ribbon bonding, molding compounds, wafer back-grind and dicing, flip-chip and wire bonding, tin plating and singulation.
• Experience qualifying high-voltage/power packages and testing in high-humidity/corrosive environments.
• Familiarity with package design and simulation tools (including AutoCAD, thermo-mechanical/thermal/electrical simulators).
• Statistical and DOE skills; experience with tools such as SAS, JMP or Minitab; understanding of SPC techniques, ANOVA and variability analysis.
• Proven experience managing OSAT/vendor relationships and building supplier networks.
• Project/program management experience and strong analytical problem-solving skills.
• Knowledge of AEQ reliability requirements, APQP automotive development process and JEDEC/IPC standards.
• Strong oral and written English communication skills.

Education Requirements

BS degree in Electrical Engineering, Mechanical Engineering or Materials Science (or equivalent technical education/experience).

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.