Semiconductor Assembly Process Technology Development Engineer

Job Title

Semiconductor Assembly Process Technology Development Engineer

Role Summary

Lead technical development for semiconductor backend (assembly and packaging) processes for advanced packages such as VPS, FCCSP, FCBGA and power packages. Work with engineering teams to select and install equipment, develop materials and processes, support production ramp-up, and drive quality and yield improvements.

This role is based in Nakatsu and supports packages for AI/HPC, automotive (ADAS), and IoT markets.

Experience Level

Mid-level - typically 5+ years' experience in semiconductor backend (assembly/packaging) process development.

Responsibilities

Primary responsibilities include equipment selection, process development, production transfer, and quality/yield improvement.

• Develop assembly processes for advanced packages (VPS, FCCSP, FCBGA, power packages).
• Select, qualify, and introduce manufacturing equipment for assembly lines.
• Develop and optimize materials and processes for molding, ball mount, marking, PKG saw, reflow, flux cleaning.
• Support manufacturing line start-up and transition to mass production.
• Lead root-cause analysis and corrective actions to improve yield and product quality.
• Collaborate with cross-functional teams (product engineering, quality, manufacturing) on design-for-manufacturability and reliability requirements.

Requirements

Must-have technical skills and experience; list of preferred skills follows.

• 5+ years' hands-on experience in semiconductor assembly/packaging process development.
• 5+ years' experience in at least one of: Ball Mount, Reflow, Flux cleaning, or Marking process development.
• Practical experience with process improvement, quality control, and equipment introduction.
• Business-level Japanese and English communication skills.

Nice-to-have:

• Experience using FTA, 5 Whys, or similar methods for failure analysis and corrective action.
• Materials selection and optimization experience for packaging materials.
• CAD experience for tooling/fixture design and optimization.
• Knowledge of semiconductor industry standards (IATF, JEDEC).
• Practical project management experience in product development.

Education Requirements

Technical degree required: engineering degree in mechanical, materials, electronic/electrical, chemical engineering or closely related technical field.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.