Wire Bond Process & Equipment Senior/Staff Engineer

Job Title

Wire Bond Process & Equipment Senior/Staff Engineer

Role Summary

Senior/Staff engineer responsible for optimizing wire bonding equipment and processes to ensure quality, reliability, and throughput in high-volume semiconductor manufacturing. The role partners with R&D, process engineering, design, quality, and manufacturing teams to support new product introductions and continuous improvement.

Experience Level

Senior / Staff level. The posting specifies approximately 5–8 years of relevant wire bonding and semiconductor process engineering experience.

Responsibilities

Core responsibilities include equipment qualification, process optimization, troubleshooting, and cross-functional support.

• Lead setup, qualification and optimization of wire bonding equipment and processes, including CZ and DOE activities.
• Drive continuous process improvements to increase yield, reliability and throughput.
• Troubleshoot and resolve equipment and process issues in a high-volume manufacturing environment.
• Disposition non-conforming materials and implement corrective and preventive actions.
• Support new product introductions (NPI) in collaboration with design, quality and manufacturing teams.
• Analyze process data, identify trends and implement data-driven improvements.
• Mentor and guide junior engineers; promote knowledge sharing and best practices.
• Maintain compliance with safety, quality and environmental standards; support internal and external audits.
• Develop and maintain process documentation such as FMEA, Control Plans, OCAP and SPC.
• Lead cost reduction and Manufacturing Value Add (MVA) improvement projects.

Requirements

Must-have technical skills and practical experience for immediate contribution. Nice-to-have items listed separately.

• 5–8+ years' experience in wire bonding equipment and semiconductor process engineering.
• Strong understanding of thermosonic and ultrasonic wire bonding techniques for gold and copper.
• Hands-on experience with ASM wire bonders, bonder programming and process optimization.
• Practical experience using statistical tools such as JMP, Minitab or equivalents.
• Proven analytical and problem-solving skills with data-driven decision making.
• Knowledge of semiconductor manufacturing standards, quality control and reliability testing.
• Excellent communication and ability to work effectively across cross-functional teams.
• Nice-to-have: Hands-on KNS experience; experience handling additional wire types beyond gold and copper.

Education Requirements

Bachelor's degree in Electrical/Electronic Engineering, Mechanical Engineering, Materials Science, or a related field.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.