Job Title
VLSI Chip Design Engineer – RTL/SoC & Verification
Role Summary
Join Annapurna Labs (part of Amazon Web Services) to work on the Nitro next-generation semiconductor platform. Contribute to architecture, RTL design, verification, integration, and delivery of IPs from definition through mass production.
Experience Level
Mid-level. The posting does not specify years of experience.
Responsibilities
Primary responsibilities include:
- Design and implement RTL for SoC IP blocks.
- Develop and execute verification plans and testbenches (SystemVerilog/UVM).
- Integrate IP into SoC and coordinate cross-team integration and bring-up activities.
- Collaborate with Architecture, Software, Verification, and Physical Design teams to meet performance, power, and area targets.
- Drive designs from definition through tapeout and production readiness.
- Support silicon debug, validation, and documentation for delivered IPs.
Requirements
Essential and preferred qualifications:
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Must-have: Practical experience in RTL design and verification for SoC or complex IP.
- Proficiency in SystemVerilog/Verilog and standard verification methodologies (e.g., UVM).
- Experience with SoC integration and cross-functional collaboration with software and physical design teams.
- Familiarity with EDA tools, simulation, and debugging workflows; scripting skills (Python, Tcl) for flow automation.
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Nice-to-have: Tapeout or silicon bring-up experience; experience with low-power design or high-speed interfaces.
Education Requirements
Not specified.
About the Company
Company: Amazon Web Services
Headquarters: Seattle, Washington, USA
Amazon Web Services (AWS) provides a comprehensive and evolving cloud computing platform that includes infrastructure as a service (IaaS), platform as a service (PaaS), and software as a service (SaaS). AWS allows business and developers to use a wide range of cloud services for computing power, storage, and content delivery, among others, thus fostering innovation and enabling faster deployment of applications. AWS is designed to be scalable, flexible, and cost-effective across industries worldwide.

Date Posted: 2026-08-19