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Verification Engineer/Lead

Volantis Semiconductor
August 27, 2026
Full-time
Remote friendly (San Francisco, California, United States)
Worldwide
Verification Jobs, Level - Senior

Job Title

Verification Engineer / Lead

Role Summary

Work on verification for SoC blocks, sub-systems and potentially entire wafer-level and cluster-level verification. Contribute technically and take ownership of verification plans and delivery.

This role supports high-performance ASIC and processor designs and partners with design, architecture and physical teams to ensure correctness and performance targets.

Experience Level

Senior level (Lead). Specific years of experience not specified.

Responsibilities

Key responsibilities include:

  • Own verification of blocks and sub-systems within SoCs.
  • Drive verification efforts for complex processor or high-performance ASIC designs.
  • Plan and execute performance verification activities.
  • Develop and maintain verification environments and test strategies.
  • Coordinate with design, architecture and physical teams to close verification gaps.
  • Potentially lead verification for wafer-level, cluster-level or full-chip integration.

Requirements

Must-have and desirable qualifications:

  • Must-have: Experience owning verification of blocks and/or sub-systems in SoCs.
  • Must-have: Experience driving verification for complex processor or high-performance ASIC designs.
  • Must-have: Experience with performance verification.
  • Nice-to-have: Experience owning verification of an entire chip or SoC.
  • Nice-to-have: Experience with multi-die / multi-chiplet / MCM verification.
  • Nice-to-have: Experience verifying networks and multi-network interfaces.

Education Requirements

Not specified.


About the Company

Company: Volantis Semiconductor

Semiconductor hardware startup developing wafer-scale heterogeneous packages that integrate silicon and compound semiconductor dies for high-TDP AI platforms. Focus areas include advanced packaging design and process development, interposer technologies, thermal/mechanical challenges, and system co-design.

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Date Posted: 2026-08-26