Undergrad ASIC Package Engineering Co-op/Intern (2027)

Job Title

Undergrad ASIC Package Engineering Co-op/Intern (2027)

Role Summary

Internship on AMD's package engineering team supporting development of advanced packaging technology for ASICs. Work will focus on substrate, interposer and bump designs and verification to support product, test-vehicle and probe-card development.

Experience Level

Entry-level internship / co-op for undergraduate students.

Responsibilities

Primary responsibilities during the co-op/intern term include hands-on design support, verification, and yield analysis under engineer mentorship.

• Support package design and development for substrates, interposers and bump layouts for products, test vehicles and probe-card substrates.
• Assist engineers with design verification implementation to ensure performance, quality and efficiency.
• Analyze yield and defect metrics and propose design changes to improve yield.
• Evaluate and benchmark packaging materials and interact with external partners for cost- and performance-optimized solutions.
• Help prioritize and optimize packaging projects with design and development teams.
• Work full-time (40 hours/week) for the assigned co-op/intern duration.

Requirements

Must-have logistical and eligibility items plus relevant technical familiarity.

• Available to work full-time (40 hours/week) for the selected co-op/intern term dates.
• Authorized to work in the United States for the duration of the assignment; this role is not eligible for visa sponsorship.
• Comfortable working onsite or in a hybrid schedule in the San Jose/Santa Clara area.

Nice-to-have technical skills:

• Coursework or experience with transmission lines and electric circuits.
• Familiarity with package, silicon or PCB design software.
• Experience with scripting languages such as Perl, Python, or SQL.
• Understanding of semiconductor theory and packaging process/technology.
• Experience with data analytics and visualization tools (for example Power BI).

Education Requirements

Currently enrolled in a US-based university undergraduate (Bachelor's) program in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Materials Science Engineering, or a closely related technical field. Applicants must be enrolled for the duration of the co-op/internship term.

About the Company

Company: Advanced Micro Devices

Headquarters: Sunnyvale, California, USA

Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.