Thin Films Module Development Engineer

Job Title

Thin Films Module Development Engineer

Role Summary

As a Module Development Engineer in Advanced Packaging Technology Development, you will develop and optimize thin-film and module manufacturing processes for semiconductor packaging to enable high-volume production and future device architectures.

Work focuses on process integration, equipment and materials collaboration, feasibility studies, statistical process control, and scaling processes to manufacturing.

Experience Level

Mid-level. Typical experience range: 3–7 years depending on degree (Bachelor's with 5+ years, Master's with 3+ years, PhD with 1+ year).

Responsibilities

Primary responsibilities include developing processes, enabling manufacturing, and coordinating across teams and suppliers.

• Design and develop thin-film/module manufacturing processes: material selection, parameter optimization, metrology, and system design.
• Drive technology development and enablement for high-volume manufacturing and future technologies.
• Conduct feasibility studies and simulations to meet device specifications and yield targets.
• Develop and execute technology roadmaps to guide manufacturing needs.
• Collaborate with equipment and material suppliers to implement process solutions.
• Optimize production efficiency, manufacturing techniques, and output for new and existing products.
• Use statistical process control and data analytics to improve process stability and drive continuous improvement.
• Recommend and implement equipment or process modifications to improve scalability and yield.
• Partner with cross-functional teams (yield, operations, suppliers) to ensure successful process integration.

Requirements

Must-have technical skills and experience. See Education Requirements below for degree and experience combinations.

• Proven experience in manufacturing process development and process integration for semiconductor or packaging technologies.
• Experience with wafer-level assembly, semiconductor processing, or advanced packaging enabling high-volume manufacturing.
• Hands-on knowledge of thin-film deposition and processing techniques: CVD, PECVD, thermal/PE ALD, and PVD.
• Practical experience with statistical process control, data analytics, and methods to improve process stability.
• Experience conducting feasibility studies and simulations to validate process approaches.
• Demonstrated ability to work with equipment and material suppliers and to translate lab processes to production.
• Strong collaboration and program-management skills to drive projects from development to production.
• Nice-to-have: experience with hybrid bonded interconnects, leading programs to high-volume production, and recognized technical leadership.

Education Requirements

Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 5+ years relevant experience; OR Master's degree in those fields with 3+ years relevant experience; OR PhD in those fields with 1+ year relevant experience. Equivalent practical experience accepted where specified.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.