Thermal Engineer — Data Center AI GPU Thermal Design
Advanced Micro DevicesJob Title
Thermal Engineer — Data Center AI GPU Thermal Design
Role Summary
Join AMD's Data Center Platform Engineering Group (DPEG) Thermal Mechanical Engineering team to own thermal architecture, validation, and deployment for MI Series AI accelerators and data-center GPU platforms. Work spans thermal modeling, laboratory validation, design analysis, and cooling-technology development across component-to-system levels.
This is an onsite role in Austin, Texas. The position is not eligible for visa sponsorship.
Experience Level
Mid-level (typically 3–7 years of relevant engineering experience). The posting does not specify exact years required.
Responsibilities
Work with cross-functional teams to develop and validate thermal solutions for next-generation data center GPUs and AI accelerators.
- Design and develop thermal solutions from component to system level for data center GPU/AI accelerator products.
- Perform thermal validation: test planning, lab experiments, data acquisition, and analysis.
- Develop and apply thermal models and simulations to inform design trade-offs and optimizations.
- Collaborate with silicon, board, power, validation, manufacturing, and platform teams to implement solutions.
- Investigate and evaluate emerging cooling technologies (air and liquid cooling) aligned with product roadmaps.
- Support product development from concept through commercialization and mass production.
- Gain familiarity with AMD thermal methodologies, tools, and processes and take increasing ownership of critical projects.
Requirements
Must-have technical skills and experience for effective performance in this role; preferred items listed separately.
- Strong knowledge of heat transfer, fluid dynamics, and electronics cooling for high-performance computing or data-center hardware.
- Experience using CFD tools such as Icepak, ANSYS AEDT, or similar simulation platforms.
- Hands-on thermal laboratory testing experience: instrumentation, data acquisition, DOE, and data analysis.
- Familiarity with air-cooled and liquid-cooled design approaches for servers and accelerators.
- Proficiency with mechanical CAD tools (e.g., SolidWorks or Creo) for thermal-mechanical design.
- Ability to work cross-functionally and communicate technical results clearly to engineering teams.
Nice-to-have:
- Experience developing liquid-cooling hardware (cold plates, manifolds, liquid interconnects).
- Exposure to scripting or data analysis tools (Python, MATLAB, C/C++, or similar) and automation of workflows.
- Prior internship, research, or industry experience with GPUs, AI accelerators, hyperscale or data-center infrastructure.
Education Requirements
Master's degree or PhD preferred in Mechanical Engineering. Advanced degrees in Aerospace Engineering, Chemical Engineering, Thermal Sciences, Fluid Mechanics, or related engineering disciplines with a strong thermal focus are also desired. Research experience in thermal management, fluid dynamics, electronics cooling, or computational modeling is preferred.
About the Company
Company: Advanced Micro Devices
Headquarters: Sunnyvale, California, USA
Advanced Micro Devices, or AMD, is a global semiconductor company that designs and manufactures microprocessors, graphics processors, and related technologies for a variety of computing devices. Known for pushing the boundaries of innovation, AMD's mission is to deliver high-performance computing solutions for AI, data centers, gaming, and embedded applications. They foster a collaborative, inclusive culture focused on creativity and problem-solving, aiming to drive progress and excellence in technology.
