Thermal Compression Bonding Development Engineer

Job Title

Thermal Compression Bonding Development Engineer

Role Summary

Develop and optimize thermal compression bonding (TCB) processes and equipment within Advanced Packaging Technology Manufacturing – Technology Development to support Intel's advanced packaging roadmap.

The role focuses on experimentation, data-driven process optimization, cross-functional collaboration, and documentation to improve quality, reliability, yield and manufacturability of semiconductor packages.

Experience Level

Entry-level / Early Career. Recent graduates or early-career engineers; less than 2 years of industry experience preferred for certain preferred qualifications.

Responsibilities

Core responsibilities include process development, data analysis, and cross-functional execution to enable next-generation packaging.

• Develop and optimize assembly processes and equipment for thermal compression bonding.
• Design and execute experiments using statistical methods and Design of Experiments (DOE).
• Analyze process data to identify opportunities to improve quality, yield, productivity, and cost.
• Collaborate with cross-functional teams to ensure manufacturability and reliability of package designs.
• Document technical advancements and improvements in reports and technical notes.

Requirements

Must-have and preferred technical skills and experience.

• Must-have: Familiarity with semiconductor assembly equipment and processes; ability to apply statistical methods and DOE to process development; capability to analyze process data for yield/quality improvements; effective collaboration and technical documentation skills.
• Preferred / Nice-to-have: Experience with data science tools (Python, SQL, JMP); proficiency in statistical process control (SPC) and data analytics; fundamental understanding of semiconductor devices and packaging technology; mechanical design experience including CAD; strong written and verbal communication; proven ability to work under tight schedules; direct relevant experience such as internships or research projects in thermal compression bonding.

Education Requirements

Master's degree in Mechanical Engineering, Materials Engineering, Electrical Engineering, Electronic Engineering, Chemical Engineering, Physics, or a related STEM field is required. PhD degree holders are preferred. Preferred candidates include PhD holders or Master’s degree holders with less than 2 years of relevant experience; Master’s candidates are expected to have First Class Honours where specified.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.