Thermal Compression Bonding Development Engineer

Job Title

Thermal Compression Bonding Development Engineer

Role Summary

Packaging module development role focused on Thermal Compression Bonding within Advanced Packaging Technology Manufacturing - Technology Development (APTM-TD). The engineer will develop and optimize assembly processes and equipment, run experiments and analyze data, and work with cross-functional teams to ensure manufacturability, reliability, and transfer to manufacturing.

Experience Level

Mid-level (Experienced hire). No specific years-of-experience requirement provided.

Responsibilities

Core duties include process development, data-driven optimization, and documentation to support advanced packaging yields and reliability.

• Develop and optimize thermal compression bonding assembly processes and related equipment for advanced packages.
• Design and execute experiments using DOE and statistical methods to establish and improve process specifications.
• Analyze process data to identify and implement improvements in quality, yield, productivity, and cost.
• Collaborate with cross-functional teams (design, reliability, manufacturing) to ensure manufacturability and reliability of package designs.
• Document technical advancements, write reports and white papers, and support knowledge transfer to manufacturing.
• Support equipment/process qualification and troubleshooting on-site.

Requirements

Summary of required and preferred skills and experience (excluding formal education, which is listed in Education Requirements below).

• Must-have: Familiarity with semiconductor assembly equipment and processes; hands-on process development and experimentation including DOE; competency in data analysis and application of statistical methods (e.g., SPC); strong written and verbal communication; ability to work on-site and meet tight schedules.
• Nice-to-have: Experience with Python, SQL, or JMP for data analysis; proficiency in statistical process control and data analytics; mechanical design and CAD experience; direct relevant experience with Thermal Compression Bonding (internship, research project, or similar); fundamental understanding of semiconductor devices and packaging technology.

Education Requirements

Master's degree required in Mechanical Engineering, Materials Engineering, Electrical Engineering, Electronic Engineering, Chemical Engineering, Physics, or a related STEM field. PhD degree is preferred. Preferred candidates include Master’s holders with less than 2 years of experience who have First Class Honours. Direct relevant internship or research experience in Thermal Compression Bonding is beneficial.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.