Technology Development Engineer – Hybrid Bonding & Advanced Packaging (Internship)
Applied MaterialsJob Title
Technology Development Engineer – Hybrid Bonding & Advanced Packaging (Internship)
Role Summary
Internship role supporting the Process Integration team on advanced packaging and hybrid bonding R&D. The position focuses on developing and characterizing test vehicles and process flows for chip‑to‑wafer and wafer‑to‑wafer hybrid bonding.
Primary mission: execute experiments, analyze process and defect data, and correlate process parameters with electrical and physical performance to advance packaging integration projects.
Experience Level
Entry-level — Internship. Suitable for students or early-career candidates seeking hands-on semiconductor process experience.
Responsibilities
Key responsibilities include:
- Support development and integration of advanced packaging building blocks including RDL, damascene copper structures, wafer-level interconnects, and hybrid bonding.
- Design and execute process flows and experiments for chip-to-wafer and wafer-to-wafer bonding test vehicles.
- Characterize defects and perform physical and electrical measurements to assess process performance.
- Analyze experimental data and correlate process parameters with performance metrics using statistical methods.
- Document results and contribute to ongoing R&D projects and engineering problem-solving efforts.
- Gain hands-on exposure to semiconductor fabrication and process integration challenges.
Requirements
The posting does not list formal, detailed requirements. Expected qualifications and conditions for this internship:
- Intern / student status (internship position; full-time during internship period).
- Interest or coursework in semiconductor processing, materials, or related engineering topics; aptitude for laboratory work.
- Ability to perform experimental work, collect and analyze data, and communicate technical results clearly.
- Must be able to work on-site in Singapore. Travel: none; relocation: not eligible per posting.
Education Requirements
Not specified.
About the Company
Company: Applied Materials
Headquarters: Santa Clara, CA, United States
Global leader in materials engineering solutions for the semiconductor and display industries, designing, manufacturing, and servicing equipment used to produce chips and advanced displays worldwide. Enables customers' production of semiconductor devices and display technologies and supports innovations like AI and IoT.
