Technical Program Manager, System-in-Package Semiconductor Packaging Operations

Job Title

Technical Program Manager, System-in-Package Semiconductor Packaging Operations

Role Summary

Manage factory output, yield, quality, and volume-ramp readiness for System-in-Package semiconductor packaging. Work with cross-functional teams (design, supplier quality, test, service, program engineers) and contract manufacturers to deliver products at scale.

This role leads operational readiness for mass production, drives yield improvements, and ensures timely resolution of manufacturing issues to meet program milestones.

Experience Level

Mid-level. No explicit years-of-experience requirement stated.

Responsibilities

Primary ownership and coordination of manufacturing performance and readiness for volume production.

• Own end-to-end factory output, yield, quality, and readiness for volume ramp.
• Integrate lessons learned into future designs and use predictive methods to identify quality risks early.
• Maintain and drive closure of issue lists prior to mass production start.
• Partner with manufacturing partners to advance yield and operational excellence through engagement and continuous improvement.
• Track manufacturing-partner performance via measurement systems, audits, and online verification; implement corrective actions across product life cycle.
• Deliver executive-level status reports on a weekly cadence.
• Escalate major concerns and present resolution options to senior management.

Requirements

Must-have technical skills, operational experience, and program management capabilities.

• Excellent written and spoken English communication skills.
• Experience in high-volume consumer-electronics manufacturing with SMT and packaging processes.
• Operations management experience, including yield improvement and OEE optimization.
• Working knowledge of quality-control methodologies: SPC, MSA, GRR, FMEA.
• Program or project management experience with ability to translate high-level goals into actionable plans.
• Experience operating within a matrix organization and leading cross-functional, cross-cultural teams.

Nice-to-have / preferred skills:

• Technical expertise in PCBA, molding, laser processing, sputtering, assembly, test, and pack-out processes.
• Hands-on experience with design of experiments (DOE) and failure analysis (FA); data-driven problem solving under pressure.
• Familiarity with automation and DFM design for semiconductor packaging operations.
• Background or experience in electrical engineering and familiarity with electrical and mechanical product inspections.

Education Requirements

Bachelor's degree in Engineering or equivalent practical experience is required. Master's degree in Engineering is preferred. Fields cited include general engineering and electrical engineering; equivalent experience is accepted where specified.

About the Company

Company: Apple

Headquarters: Cupertino, California, United States

Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.