Technical Program Manager - Image Sensor & Process Integration

Job Title

Technical Program Manager - Image Sensor & Process Integration

Role Summary

Lead continuous improvement and process integration for image sensor semiconductor devices across product development, ramp and mass production. Work with internal engineering teams, device vendors, module integrators and cross-functional stakeholders to drive yield, quality, and manufacturability.

Role requires international vendor engagement, on-site visits, and escalations to ensure device readiness and sustained production performance.

Experience Level

Senior — requires 7+ years of technical experience working with semiconductor devices, data-driven problem solving, and production issue resolution.

Responsibilities

Key responsibilities include:

• Define and drive continuous product quality and operational improvement targets, including aggressive yield goals.
• Analyze manufacturing and test data to identify root causes and implement process-level yield improvements.
• Influence product design for manufacturability (DFM) from concept through ramp.
• Approve vendor process flows, quality control plans (tests, methods, sample sizes, pass/fail criteria), equipment and qualification plans.
• Manage new process introductions, special projects, and mass-production readiness approvals for device manufacturers.
• Ensure device vendors meet Apple specifications and qualification/reliability requirements.
• Drive test-correlation activities and close test gaps between device, module, and system levels.
• Lead resolution of device-related quality issues across wafer fab, back-end processing, transit, and module integration.
• Monitor and report manufacturing metrics (CpK, FMEA, yield) and lead improvement programs.
• Organize and lead multi-party reviews with device vendors and module integrators; manage escalations and executive reporting.

Requirements

Must-have technical skills and experience:

• Deep technical understanding of semiconductor device behavior, failure analysis, and data-driven root-cause investigation.
• Proven track record driving yield improvement and process development in a production environment.
• Experience with process integration across wafer fab, back-end processing, wafer test and packaging.
• Experience managing vendor qualification, audits, and ongoing quality relationships.
• Familiarity with manufacturing metrics and quality systems (CpK, FMEA, 8D, PCN) and test correlation practices.
• Strong leadership, communication, cross-functional collaboration and project-management skills; able to report to executives and lead escalations.
• Willingness to travel internationally and work occasional evenings/weekends as required.

Preferred / nice-to-have:

• Working knowledge of silicon processing (etch, litho) or III-V processes and associated module components.
• Experience with cosmetic specifications and downstream module integration issues.

Education Requirements

MS or PhD in Electrical Engineering, semiconductor devices, or an allied technical field (as stated in the posting).

About the Company

Company: Apple

Headquarters: Cupertino, California, United States

Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.