Technical Program Manager (f/m/d)

Job Title

Technical Program Manager (f/m/d)

Role Summary

Lead end-to-end program execution for ASIC and chiplet products that combine electronics and photonics, from concept through validation, qualification, and product release. You will coordinate cross-functional engineering teams, external IP and qualification providers, and product management to deliver against schedule, technical, cost, and quality targets.

This role combines hands-on program management with sufficient technical fluency to identify integration and schedule risks early and drive mitigation to keep programs on track.

Experience Level

Mid-level. Typical experience: 5–8 years managing silicon, ASIC, IP, or photonics development programs.

Responsibilities

Manage a defined ASIC/chiplet program end-to-end and ensure on-time delivery to production quality.

• Create and maintain program schedules, identify critical paths, and keep execution on track.
• Translate product requirements into executable technical plans and manage scope/schedule trade-offs with Product Management.
• Coordinate multi-die/chiplet integration, known-good-die qualification, and development build deliveries.
• Own relationships with external IP vendors, qualification providers, and test houses; track their deliverables and run review cadences.
• Lead the Program Core Team to align decisions, manage dependencies, and escalate issues proactively.
• Manage supplier interactions, resource allocation, change control, and program documentation.
• Report program status and risks to leadership and stakeholders.

Requirements

Must-have skills and experience to perform the role.

• 5–8 years managing semiconductor programs (silicon, ASIC, IP, or photonics) with ownership across product lifecycle stages.
• Proven experience managing programs involving external IP vendors, qualification providers, or test houses; experience in chiplet, multi-die, or advanced packaging is strongly preferred.
• Hands-on with ASIC/silicon development flows, chiplet/multi-die integration, qualification processes, PLM/change control, risk management, and program tracking tools.
• Ability to translate requirements into milestones, metrics, schedules, risks, and dependencies; strong critical-path and bottleneck identification.
• Demonstrated experience leading cross-functional engineering teams and coordinating suppliers, manufacturing partners, and external stakeholders.
• Strong communication, stakeholder management, problem-solving, and independent working skills.

Nice-to-have:

• German language skills.
• Program Management certification and knowledge of chiplet architectures and advanced packaging trends.

Education Requirements

Bachelor's degree in Engineering, Computer Science, or a related technical field, or equivalent practical experience.

About the Company

Company: Black Semiconductor

Headquarters: Aachen, Germany

Black Semiconductor is revolutionizing the semiconductor industry with innovative graphene solutions that enhance chip connectivity and efficiency. By merging electronic computing and photonic communication, the company aims to reshape how chips interact, driving significant advancements in power and speed. Their human-centered approach fosters collaboration and continuous learning, making it a dynamic place for professionals to grow and make an impact.