Technical Program Manager

Job Title

Technical Program Manager

Role Summary

Lead and execute end-to-end ASIC and chiplet product programs that combine electronics and photonics in advanced multi-die packages. You will coordinate cross-functional engineering teams, product management, suppliers, and third-party IP/qualification providers to deliver against schedule, technical, cost, and quality targets.

This role combines hands-on program management with sufficient technical fluency to identify integration and schedule risk early and drive mitigation to production release.

Experience Level

Mid-level — typically requires 5+ years managing silicon, ASIC, IP, or photonics development programs and ownership of product lifecycles from concept through validation, qualification, and release.

Responsibilities

Accountable for planning, tracking, and delivering a defined ASIC/chiplet program. Key responsibilities include:

• Develop and maintain program schedules, identify critical paths and bottlenecks, and drive execution to milestones.
• Coordinate conception, development, and delivery of electronic and photonic integrated circuit programs, including multi-die/chiplet integration and known-good-die qualification.
• Manage relationships with external IP vendors, qualification providers, and test houses; track their deliverables and escalate risks before they impact the critical path.
• Translate product requirements and priorities into an executable technical program plan in partnership with Product Management.
• Lead the Program Core Team to align decisions, manage dependencies, and resolve technical and cross-functional issues.
• Manage chip delivery for development builds and ensure qualification readiness for mass production schedules.
• Maintain program documentation, PLM records, change control logs, and accessible program artifacts.
• Coordinate suppliers, allocate resources, and establish review cadences with supply chain and operations.

Requirements

Must-have skills and experience, plus a short list of desirable additions.

• Must-have: 5+ years managing complex semiconductor programs involving ASIC/silicon, IP, photonics, or chiplet/multi-die projects with end-to-end ownership.
• Proven experience coordinating external vendors, qualification providers, or test houses for semiconductor product delivery.
• Hands-on knowledge of ASIC/silicon development flows, chiplet/multi-die integration, qualification processes, risk management, change control, supplier coordination, and program tracking tools.
• Ability to translate requirements into executable technical plans, manage trade-offs, and drive cross-functional execution using milestones, metrics, schedules, and dependency management.
• Strong communication, stakeholder management, problem-solving, and leadership skills; able to work independently and within multidisciplinary teams.
• Fluency in English.
• Nice-to-have: German language skills; Program Management certification; knowledge of chiplet architectures and advanced packaging ecosystems.

Education Requirements

Bachelor's degree in Engineering, Computer Science, or a related technical field, or equivalent practical experience. Program Management certification is considered a plus.

About the Company

Company: Black Semiconductor

Headquarters: Aachen, Germany

Black Semiconductor is revolutionizing the semiconductor industry with innovative graphene solutions that enhance chip connectivity and efficiency. By merging electronic computing and photonic communication, the company aims to reshape how chips interact, driving significant advancements in power and speed. Their human-centered approach fosters collaboration and continuous learning, making it a dynamic place for professionals to grow and make an impact.