TD NAND CMOS Process Integration Principal/MTS Engineer Lead

Job Title

TD NAND CMOS Process Integration Principal/MTS Engineer Lead

Role Summary

Lead a team of CMOS device and integration engineers to design, develop, integrate and implement CMOS device and process solutions that improve NAND product yield, reliability, quality, cost and performance. Work with process, yield, quality, probe, media health, design and product engineering to deliver technology objectives across local and global teams.

Experience Level

Senior — minimum 5 years of semiconductor industry experience with process integration responsibilities; substantial experience leading technical teams and cross-functional projects.

Responsibilities

Accountable for technical leadership, team development, and delivery of CMOS integration solutions across NAND technologies.

• Hire, develop, coach and manage a team of CMOS device/integration engineers and technicians; manage performance and career growth.
• Define and develop CMOS technology to meet structural and electrical specifications and module maturity targets.
• Monitor yield and product performance metrics; lead projects to improve yield, reliability and quality.
• Drive cross-functional teams to resolve module performance deficiencies and close technology gaps.
• Design and execute experiments to improve module performance and define process windows.
• Evaluate and develop new modules and devices for integration into future technology nodes; support transfer to manufacturing.
• Optimize process flows and lead technical innovation with global impact and visibility.
• Report project status to senior management and lead discussions at yield summits and program reviews.
• Integrate AI-assisted tools and insights into workflows to improve efficiency and quality.

Requirements

Key technical, managerial and operational requirements. Items labeled "Must-have" are essential; "Nice-to-have" indicates preferred experience.

• Must-have: 5+ years semiconductor industry experience with strong process integration background and demonstrated execution across modules.
• Must-have: Strong background in CMOS integration, scaling and device physics; in-depth understanding of layout, architecture, inline and electrical metrics and bench data.
• Must-have: Direct experience with nonvolatile memories and familiarity with NAND process flow, yield and reliability issues.
• Must-have: Proven ability to lead, train and develop technical teams and to communicate complex technical issues clearly to varied audiences.
• Must-have: Experience driving cross-functional projects and working with worldwide teams; strong problem-solving and analytical skills.
• Must-have: Ability to travel for extended periods to the US for collaborative technology development work.
• Must-have: Baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively.
• Nice-to-have: Exposure to Technology Development (TD); prior DRAM and/or NAND research and development experience.
• Nice-to-have: Experience with integration/module maturity indices and large-scale manufacturing transfers.

Education Requirements

MS required or PhD preferred in Electrical Engineering, Microelectronics, Materials Science or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.