TD Media and Collaterals Development Engineer

Job Title

TD Media and Collaterals Development Engineer

Role Summary

Develop media and collateral solutions for semiconductor assembly and packaging to meet quality, reliability, cost, yield, and manufacturability targets. Work includes specification, prototype fabrication, accelerated reliability evaluation, test equipment development, and cross-functional engagement with packaging technology and partner engineering teams.

This position requires regular onsite presence in Phoenix, AZ and focuses on enabling packaging platform technology development and product milestones.

Experience Level

Entry-level. Minimum ~6 months relevant development or research experience; internships, academic project work, or equivalent practical experience are considered.

Responsibilities

Accountable for designing, qualifying, and improving media and collaterals used in assembly and packaging processes.

• Develop specifications for media and collaterals and apply DOE and SPC principles to experiments and data analysis.
• Design, build, and maintain equipment and test rigs to evaluate media/collateral performance under simulated field conditions (heat, humidity, vibration, thermal cycling, dynamic forces).
• Create accelerated test methods, tools, and quality screens to identify reliability issues early.
• Perform material selection, prototype development, and failure-mechanism analysis to meet assembly module needs.
• Standardize qualification methods and manufacturing prototypes; document results through technical reports or white papers.
• Provide technical consultation to process teams and respond to customer or production events.

Requirements

Below are the core skills and experience expectations. Education degrees are listed separately under Education Requirements.

• Must-have:
  • Approximately 6 months of hands-on experience in engineering or applied science development activities.
  • Working knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE).
  • Experience with experiment design, data analysis, prototype fabrication, and hands-on testing.
  • Ability to develop and evaluate test methods and equipment for environmental and mechanical stress conditions.
  • Effective technical communication and documentation skills.
• Nice-to-have:
  • Mechanical CAD experience (SolidWorks, AutoCAD, etc.).
  • Portfolio of projects from concept to fabrication.
  • Experience with assembly equipment, process media, or collateral qualification.
  • Familiarity with semiconductor fabrication and packaging processes.
  • Proven technical innovation and experience delivering results on complex, time-critical projects.

Education Requirements

BS, MS, or PhD in Mechanical Engineering, Materials Engineering, Electrical Engineering, Physics, or a related technical field; or equivalent practical experience gained via industry work, internships, coursework, or research.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.