TD Media and Collaterals Development Engineer

Job Title

TD Media and Collaterals Development Engineer

Role Summary

Develop and optimize assembly processes, equipment, and evaluation methods for semiconductor package technologies. Work with suppliers and cross-functional teams to ensure manufacturability, quality, reliability, cost and yield for packaging platforms.

This role requires regular on-site presence in Phoenix, AZ and focuses on packaging process development, reliability testing, and supplier qualification.

Experience Level

Entry-level — approximately 6 months of relevant engineering experience required; suitable for early-career candidates.

Responsibilities

Accountable for developing, validating, and improving packaging processes, equipment, and qualification methods to support product roadmaps.

• Develop and optimize assembly processes and equipment for advanced package technologies.
• Improve manufacturing efficiency to meet quality, reliability, cost, yield and productivity targets.
• Create process and equipment specifications using Design of Experiments (DOE) and statistical analysis; document improvements.
• Develop and maintain equipment to evaluate silicon and package technologies under environmental and mechanical stress.
• Define material specifications and work with suppliers, supplier quality, and procurement to ensure vendor performance.
• Set reliability requirements and influence design, material selection, and process development based on failure mechanisms.
• Lead problem-solving, continuous improvement, and innovation efforts using experimental design and statistical methods.
• Provide technical consultation on packaging issues and respond to customer or production events.

Requirements

Must-have skills and practical experience; preferred items are noted.

• ~6 months practical experience applying fundamental science and engineering concepts in development projects.
• Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE).
• Experience developing process and equipment specifications and performing data analysis for manufacturing quality and yield.
• Preferred: mechanical design software experience (SolidWorks, AutoCAD).
• Preferred: hands-on experience with assembly equipment, process media, or collateral handling.
• Preferred: familiarity with semiconductor fabrication processes and reliability test methods.

Education Requirements

Required: Bachelor's (BS) in Mechanical Engineering, Materials Engineering, Electrical Engineering, Physics, or a related STEM field. Preferred: Master's (MS) in a related STEM field. Equivalent practical experience, internships, or relevant coursework may be considered.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.