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TD Foundry Engineering Principal Engineer

Intel Corporation
August 25, 2026
Full-time
Remote friendly (Hillsboro, Oregon, United States)
Worldwide
$220,920 - $311,890 USD yearly
Process Engineering Jobs, Level - Senior

Job Title

TD Foundry Engineering Principal Engineer

Role Summary

Senior technical leader responsible for defining and executing foundry yield, performance, and NPI strategies across device, integration, test, and assembly functions. Acts as an executive technical liaison to major foundry customers and internal leadership to enable scalable transitions to high-volume manufacturing.

This role drives cross-functional programs (device engineering, process integration, metrology, PDK, test and assembly) to mitigate systematic yield loss, validate design-to-silicon correlation, and ensure customer product success.

Experience Level

Senior. Minimum industry experience expectations documented in the posting: PhD + 10 years or Master's + 13 years of relevant semiconductor experience; preferred: 10+ years direct semiconductor yield and performance leadership.

Responsibilities

Lead technical strategy, customer engagement, and cross-functional execution to deliver foundry product readiness and volume ramp.

  • Define and govern yield and performance strategy for foundry product lifecycle and transitions to HVM.
  • Set long-term roadmaps for yield/performance goals and technology features aligned with business and development groups.
  • Lead initiatives to identify and eliminate systematic and parametric yield detractors across integration, device, and metrology teams.
  • Oversee predictive modeling efforts (including AI/ML) for yield and defect projection and correlate metrics to end-of-line performance.
  • Direct NPI execution: wafer-lot tracking, skew split strategies, DOE design, and time-to-market optimization.
  • Drive PDK quality, silicon-to-simulation correlation, and layout effect validation to reduce design iterations.
  • Serve as executive technical interface to customers; deliver strategic technical readouts and health reports to senior management and customer executives.
  • Chair or advise governance bodies (e.g., Waiver Review Board) to manage DRC and other technical risks.
  • Architect integration between development, assembly, and test to ensure cohesive wafer-to-package flow and scaleability.
  • Lead continuous improvement and standardization efforts across fabs and TD factory teams to improve yield and performance commits.

Requirements

Core technical and leadership requirements (degree specifics appear in Education Requirements below).

  • Substantial experience in semiconductor integration, device engineering, or yield engineering with demonstrated program leadership.
  • Proven ability to lead cross-functional teams and to resolve escalated technical blockers for high-value customer programs.
  • Expertise in yield analysis, pareto construction, modeling and projection, and development of yield/performance roadmaps.
  • Experience with NPI processes, wafer/test/assembly workflows, E-Test, SORT programs, and inline inspection methodologies.
  • Capability to define and validate PDKs, silicon-to-simulation correlation, and layout effects for design enablement.
  • Skilled in experimental design (DOE), skew split planning, and statistical process metrics (Cp/Cpk, WAT/C).
  • Strong executive communication skills and experience with C-suite customer interactions and large program health reporting.
  • Preferred: experience leading foundry teams, collaborating with fabless design houses, and applying AI/ML for yield/predictive analytics.
  • Position of Trust: role requires consent to and successful completion of an extended background investigation.

Education Requirements

Minimum: Master's degree plus 13+ years of industry experience OR PhD plus 10+ years of industry experience. Accepted fields: Electrical Engineering, Materials Science, Physics, Chemical Engineering, or other relevant engineering or physical science disciplines. The required years of related work experience must be in semiconductor integration, device engineering, or yield engineering.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-08-25