System Technology Research Engineer (PhD Intern)
Intel CorporationJob Title
System Technology Research Engineer (PhD Intern)
Role Summary
Join Intel's Foundry System Technology team to develop System Technology Co-optimisation (STCO) methodology and evaluate 2.5D/3D dis-aggregation schemes for memory and logic stacking. The role focuses on system-level evaluations across devices, interconnects, materials, patterning, and integration to inform semiconductor and packaging roadmaps.
Experience Level
Entry-level internship. Typical candidates have 1–2+ years of relevant research experience in system architecture modeling, VLSI/layout, EDA, or multi-physics modeling.
Responsibilities
The intern will contribute to method development, modeling, and cross-team evaluations. Key responsibilities include:
- Develop and enhance STCO methodologies for semiconductor and package co-optimization.
- Perform system-level evaluations of devices, interconnects, patterning, materials, systems, and integration schemes.
- Evaluate 2.5D and 3D dis-aggregation schemes using solder microbumps or hybrid bonding for memory and logic stacking across product architectures.
- Collaborate with cross-functional teams to integrate findings into product and process roadmaps.
- Document results, present analyses, and communicate technical tradeoffs to stakeholders.
- Internship duration: minimum 3 months during summer 2026; possible extension based on business needs.
Requirements
Must-have technical skills and experience; preferred items listed separately.
- 1–2+ years of research experience relevant to system architecture modeling, digital circuit analysis and design, VLSI physical layout, EDA, or multi-physics modeling of electronic materials/systems.
- Familiarity with IC design and physical layout tools such as Cadence Virtuoso or Synopsys Fusion Compiler.
- Analytical problem-solving, strong prioritization, and effective written and verbal communication skills.
- Ability to work collaboratively across teams and manage stakeholder interactions.
Preferred / nice-to-have:
- System architecture design and modeling experience.
- IC design, simulation, physical layout, and tapeout experience.
- Familiarity with DRAM and SRAM circuit design and layout and integrated-circuit manufacturing flow.
- Experience with 2.5D/3D packaging technologies and 3DIC design/simulation.
- Programming skills, preferably Python.
Education Requirements
Active Ph.D. candidacy required in Electrical Engineering, Electronics Engineering, Computer Architecture and Design, or a closely related field. The posting indicates academic standing as a PhD student and accepts knowledge obtained through coursework or research.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
