Substrate Supplier Enablement Engineer

Job Title

Substrate Supplier Enablement Engineer

Role Summary

Lead substrate supplier development and qualification activities to enable new manufacturing capacity for advanced packaging substrates (e.g., high-density FCBGA, EMIB-T, glass core). Work as part of the Substrate Technology Integration Group within Advanced Packaging Technology Development to drive supplier readiness, manage milestones, and coordinate across internal engineering teams and external suppliers.

This role requires periodic evening meetings with East Asian suppliers and occasional travel to supplier sites.

Experience Level

Mid-level. Typical experience aligns with engineers who have several years in manufacturing or supplier development (see Education Requirements for degree-to-experience mapping).

Responsibilities

Primary responsibilities focus on supplier enablement, process integration, and qualification to achieve production-ready substrate capacity.

• Lead supplier development and qualification for advanced substrate technologies and manufacturing building blocks.
• Collaborate with supplier engineering teams and internal integration teams on process definitions and interactions.
• Drive supplier technical enablement and ensure adherence to Product Control System (PCS) commitments.
• Define and execute factory technology validation and product certification plans targeting yield improvement.
• Create and maintain detailed micro-schedules and milestones for new factory startup and capacity ramp.
• Lead qualification activities and monitor ramp indicators to enable incident-free production ramps.
• Support cross-functional problem resolution and coordinate actions across global teams.

Requirements

Key skills and experience required or strongly preferred. Degree and years-of-experience details are in the Education Requirements section below and have been omitted here to avoid duplication.

• Must-have: Practical experience using statistical tools and Statistical Process Control (SPC) for yield improvement.
• Must-have: Experience managing complex projects and delivering results in high-volume manufacturing environments.
• Nice-to-have: Background in advanced packaging, substrate or semiconductor manufacturing and supplier management.
• Nice-to-have: Experience with process flow development, FMEA, DOE design, and formal problem-solving tools.
• Nice-to-have: Proven ability to work in ambiguous, fast-paced environments and align global teams.

Education Requirements

Bachelor's degree plus 6+ years of relevant experience, OR Master's degree plus 4+ years, OR PhD plus 2+ years in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.