Substrate Engineer

Job Title

Substrate Engineer

Role Summary

Work with Broadcom's IC substrate subcontractors and internal engineering teams to resolve packaging and manufacturing issues and to mature new packaging technologies into high-volume production. Provide NPI, production engineering, yield and quality support for IC substrate manufacturing.

Experience Level

Senior-level role. The posting requests approximately 8+ years of relevant experience in IC substrate manufacturing technologies and processes.

Responsibilities

Primary responsibilities include engineering support for substrate manufacturing, drive-to-production activities, and supplier management.

• Collaborate with substrate subcontractors to manage and resolve packaging, yield, quality, and delivery issues.
• Support New Product Introduction (NPI), risk assessments, process improvement, and production engineering for high-volume manufacturing.
• Drive process and visual/mechanical yield improvements and cycle-time reductions during pre-production and ramp.
• Standardize best-known methods across sites and verify compliance with Broadcom requirements.
• Manage cross-functional issue containment and escalation with operations, quality, suppliers, customers, and internal teams.
• Lead capability enhancement and cost-reduction projects with suppliers and internal stakeholders.
• Provide technical leadership on substrate interactions with assembly processes (BGA, flip‑chip, wirebonding, molding, singulation, die attach).

Requirements

Key must-have and preferred qualifications drawn from the posting.

• Must-have: 8+ years of direct process and operational experience in IC substrate manufacturing and operations lines.
• Must-have: Expertise in ABF substrate interactions with BGA and flip‑chip and laminate substrate interactions with die attach, wirebonding, molding, flip‑chip attach, and singulation.
• Must-have: Proven ability to manage and coordinate complex activities across operations, quality, business units, suppliers, and customers; experience working with packaging subcontractors.
• Must-have: Strong problem‑solving and failure analysis skills; ability to assess risk and manage escalations quickly.
• Must-have: Strong written and spoken English; fluent Mandarin.
• Must-have: Willingness to travel throughout Asia to support manufacturing sites.
• Nice-to-have: Experience with component quality interactions related to SMT processability.

Education Requirements

Bachelor's degree in an engineering discipline required: Mechanical, Manufacturing, Materials Science, Chemical, or Electrical Engineering (as stated in the posting).

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.