Structural, Thermal & Packaging Analyst (Semiconductor FEA) IV
Applied MaterialsJob Title
Structural, Thermal & Packaging Analyst (Semiconductor FEA) IV
Role Summary
Senior technical engineer responsible for structural, thermal and packaging finite-element analysis (FEA) of semiconductor equipment. Lead design and qualification of modules and subsystems, support lab and field troubleshooting, and drive R&D and feasibility studies for new technologies.
Experience Level
Senior. Role requires advanced technical leadership and experience mentoring others; no explicit years-of-experience stated.
Responsibilities
Core responsibilities focus on leading analysis, development, qualification and resolution of complex system issues.
- Lead and execute complex system and module FEA projects for structural, thermal and packaging issues.
- Define experiments, test plans and data needs; qualify systems and sub-systems against specifications.
- Troubleshoot complex physics-related problems in lab and field; perform root-cause analysis and drive corrective actions.
- Initiate and lead R&D and feasibility studies to extend system performance or adopt new technologies.
- Manage vendor selection and technical interactions for modules; collaborate with customers, universities and consortia.
- Prepare technical reports, presentations and publications to communicate results and support decisions.
- Mentor and provide technical guidance to less-experienced engineers and scientists.
- Travel to support field or customer activities (~10% travel).
Requirements
Must-have technical skills and demonstrated experience for immediate contribution.
- Proven expertise in finite-element analysis (structural and thermal) applied to semiconductor equipment or similar complex systems.
- Experience with commercial FEA tools and workflows (e.g., ANSYS, Abaqus, COMSOL) and CAD/meshing integration.
- Hands-on experience in thermal management, mechanical packaging design and materials behavior under operational conditions.
- Track record leading complex engineering projects, defining requirements and qualifying hardware.
- Strong analytical, problem-solving and technical communication skills; able to present complex results to stakeholders.
- Experience supporting lab and field testing and working with cross-functional teams.
Nice-to-have: experience with semiconductor manufacturing equipment, vendor management experience, publications or patents.
Education Requirements
Not specified.
About the Company
Company: Applied Materials
Headquarters: Santa Clara, CA, United States
Global leader in materials engineering solutions for the semiconductor and display industries, designing, manufacturing, and servicing equipment used to produce chips and advanced displays worldwide. Enables customers' production of semiconductor devices and display technologies and supports innovations like AI and IoT.
