Staff Thin Film Process Development Engineer

Job Title

Staff Thin Film Process Development Engineer

Role Summary

Develop and own advanced thin-film deposition processes supporting next-generation semiconductor memory technologies. Work within Technology Development to translate device and integration requirements into measurable film properties, drive experiments and DOE, and integrate processes into semiconductor test structures and process flows.

Experience Level

Senior-level. The role requires demonstrated, advanced process-development experience; the posting specifies more than 6 years of semiconductor industry experience.

Responsibilities

Primary responsibilities include process development, experimental design, characterization, and cross-team integration.

• Develop, optimize, and own thin-film deposition processes using CVD, PECVD, ALD, PEALD, or related technologies.
• Translate device, patterning, and integration requirements into film properties, process specifications, and manufacturable solutions.
• Design and execute experiments and DOEs to identify process mechanisms, sources of variation, and defectivity.
• Establish relationships between process conditions, film properties, patterning/integration behavior, electrical performance, yield, and reliability.
• Drive thin-film concepts from feasibility through integration and demonstration in semiconductor test structures and flows.
• Partner with patterning, etch, metrology, process integration, equipment, device, and supplier teams on cross-module engineering problems.
• Evaluate new deposition technologies, materials, precursors, and capabilities using data-driven and physics-based decision-making.
• Provide technical leadership, define development direction, communicate recommendations, and mentor engineers across multidisciplinary teams.

Requirements

Key technical skills and proven abilities required and preferred for success in this role.

• Must-have: Hands-on experience developing and owning semiconductor deposition techniques (ALD, CVD, PECVD, PEALD, or similar).
• Must-have: Strong understanding of thin-film deposition fundamentals, surface/reaction mechanisms, material properties, and process integration.
• Must-have: Proven ability to independently move complex process-development problems from root-cause investigation through DOE, experimental validation, data analysis, and technical recommendation.
• Must-have: Experience collaborating across process modules and technical teams to resolve process, defectivity, integration, yield, or reliability challenges.
• Nice-to-have: Experience developing dielectric, hard-mask, spacer, insulating, etch-selective, or electrically functional thin films for advanced semiconductor applications.
• Nice-to-have: Hands-on experience with characterization techniques such as XPS, AFM, XRD, AES, ellipsometry, TEM/SEM, EBSD, or SIMS.
• Nice-to-have: Experience integrating new materials or deposition processes into advanced process flows or test structures, and using AI-assisted analytics for data interpretation and process optimization.

Education Requirements

Minimum: Bachelor's degree in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, Physics, or a related technical field - or equivalent practical experience. The posting also specifies more than 6 years of semiconductor industry experience. (Information derived from the Minimum Qualifications.)

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.