Staff Signal Integrity Engineer

Job Title

Staff Signal Integrity Engineer

Role Summary

Lead signal integrity (SI) design, simulation, optimization and validation for next-generation AI superchip and data-center platforms, covering SoC, advanced packaging (2.5D/3D), PCB and system-level interconnects.

Work cross-functionally with silicon PHY, package, PCB, architecture and validation teams to define SI guidelines, correlate simulation to silicon, and achieve electrical sign-off for high-speed interfaces.

Experience Level

Senior - typically requires 8+ years of relevant experience in high-speed signal integrity, packaging, or system-level electrical design.

Responsibilities

The role focuses on SI for high-speed channels, model development, optimization and collaboration for design and validation.

• Drive SI design, modeling, simulation and validation across SoC, advanced packaging (2.5D/3D), PCB and system-level interconnects.
• Perform high-speed channel analysis and optimization for DDR5/LPDDR, PCIe/CXL, Ethernet, die-to-die (D2D) and SerDes interfaces.
• Develop and validate EM, S-parameter, IBIS/IBIS-AMI and behavioral models for chip-to-chip and chip-to-memory interfaces.
• Lead SI optimization: insertion/return loss, crosstalk, impedance discontinuities, equalization and BER/eye-margin analysis.
• Collaborate with PHY, package, PCB, architecture and validation teams to produce SI design guidelines and simulation-to-silicon correlation.
• Support advanced packaging technologies including chiplets, interposers and high-density substrates for heterogeneous integration.

Requirements

Must-have technical skills and experience.

• 8+ years of experience in high-speed signal integrity engineering, semiconductor packaging, or system-level electrical design.
• Strong expertise with SI simulation and 3D electromagnetic tools such as Ansys HFSS, SIwave, Keysight ADS or equivalents.
• Deep understanding of high-speed I/O signaling, transmission lines, S-parameters, crosstalk, equalization, timing and BER analysis.
• Hands-on experience with advanced packaging, DDR/LPDDR memory interfaces, PCIe/CXL and high-speed SerDes technologies.
• Strong analytical and problem-solving skills and experience working in multi-functional engineering teams.

Nice-to-have:

• Experience with AI/HPC supercomputing platforms, chiplet integration, package-to-board co-design, silicon bring-up and simulation-to-measurement correlation.

Education Requirements

Bachelor's, Master's or PhD in Electrical Engineering or a related field (BS/MS/Ph.D. in Electrical Engineering or related discipline as listed by the employer).

About the Company

Company: Arm

Headquarters: Cambridge, United Kingdom

ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.