Staff Product Engineer

Job Title

Staff Product Engineer

Role Summary

Responsible for end-to-end product ownership at OSATs from New Product Introduction (NPI) through High Volume Manufacturing (HVM), focusing on test yield, quality, reliability, and productivity improvements. Acts as the technical lead coordinating Product Engineering, Test Engineering, Design, Fab Foundries, OSATs, and Business Units to resolve product-specific issues and enable sustained high-volume production.

Experience Level

Senior professional level. The role expects approximately 8+ years of semiconductor industry experience and demonstrated NPI-to-HVM execution ownership.

Responsibilities

Key responsibilities include cross-functional execution, technical investigation, and release decisions for assigned products.

• Lead NPI-to-HVM ramp and ensure manufacturing readiness following PDE gate models.
• Drive resolution of yield, test coverage, quality escapes, test time, and cost issues.
• Monitor test yield trends, perform Pareto and root-cause analysis, and close yield gaps.
• Conduct statistical and data-driven investigations (SPC, GR&R, Cp/Cpk) across probe and final test.
• Manage disposition of problematic lots and lead failure analysis and historical trend correlation.
• Collaborate on test program verification, correlation, validation, and production release criteria.
• Align global stakeholders on test strategy, capacity, cost, and deployment plans.
• Promote PE competency, continuous improvement, and Lean/PDCA execution.

Requirements

Must-have technical skills, behaviors, and constraints for the role.

• Minimum ~8 years semiconductor industry experience with NPI and HVM execution.
• Knowledge of RF communication systems and RF front-end component technologies.
• Experience with test equipment and manufacturing tools (ATE RF testers, handlers, probers, lab bench tools).
• Strong data analytics and problem-articulation skills; experience with JMP, Spotfire, Power BI, or similar tools; familiarity with data science/AI tools for analytics is expected.
• Experience with Lean manufacturing methods, PDCA, DMAIC, and POR/POA execution.
• Ability to perform deep-dive failure analysis, parametric correlation, and trend analysis.
• Willingness to travel across APAC and work extended hours as business needs dictate.
• Effective English communication and cross-functional collaboration skills.

Education Requirements

Bachelor's degree in Electronic or Electrical Engineering is required. The posting specifies a minimum of 8 years of semiconductor-industry experience; no other degrees, fields, or certifications were listed.

About the Company

Company: Qorvo

Headquarters: Greensboro, NC, US

Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.