Staff Process Engineer (Die Attach)

Job Title

Staff Process Engineer (Die Attach)

Role Summary

Lead and manage die attach/die bond manufacturing processes to achieve target quality, yield, productivity, and reliability. Responsible for process development, optimization, qualification, sustaining, and NPI for die bond technologies.

Manage a team of process engineers and coordinate with Production, Equipment Engineering, Quality, R&D, suppliers and customers to drive operational excellence and meet business objectives.

Experience Level

Senior-level. Minimum 10 years semiconductor assembly experience with at least 5 years in Die Bond/process engineering leadership.

Responsibilities

Primary responsibilities focused on die bond process ownership, improvement, qualification and support.

• Own and manage die bond process technologies (epoxy die attach, eutectic, and advanced die attach methods).
• Drive process optimization to improve yield, remove defects, and increase equipment utilization.
• Establish and maintain critical process controls for placement accuracy, bond line thickness, epoxy coverage, voids, and die shear strength.
• Lead root-cause analysis and corrective actions for die-bond quality issues using 8D, DMAIC, DOE and statistical methods.
• Develop and execute process qualification plans for new materials, equipment, packages, and technology transfers (IQ/OQ/PQ).
• Partner with Equipment Engineering to improve machine capability, preventive maintenance, uptime, OEE and MTBA.
• Lead NPI and package transfer activities involving die bond development, validation and volume ramp-up.
• Monitor and improve die-bond KPIs (yield, placement accuracy, void rate, epoxy defects, die shear, OEE, MTBA, customer complaints).
• Ensure compliance with IATF16949, customer requirements, Control Plans, PFMEA, SPC and other quality systems.
• Lead customer audits, qualification reviews and technical failure-analysis discussions; train and mentor engineers, technicians and operators.

Requirements

Must-have technical skills, experience and competencies for the role.

• Minimum of 10 years semiconductor assembly experience with at least 5 years in die bond/process engineering leadership.
• Proven experience managing engineers and technical teams in a manufacturing environment.
• Expert knowledge of die bond processes and equipment, and semiconductor packaging technologies.
• Experience in NPI, package transfer and high-volume manufacturing environments.
• Strong skills in DOE, SPC, MSA, PFMEA, Control Plans and statistical analysis for process characterization.
• Practical failure analysis and root-cause investigation experience.
• Experience with process validation (IQ/OQ/PQ) and process qualification planning.
• Knowledge of epoxy materials, solder attach, sintering and packaging reliability.
• Proficiency with data-analysis tools such as JMP, Minitab and Excel.
• Familiarity with automotive quality standards and processes (IATF16949, VDA, APQP, PPAP, FMEA) and experience supporting customer audits.

Education Requirements

Bachelor's or master’s degree in engineering (Electrical, Electronic, Mechanical, Materials Science), Physics, or equivalent practical experience accepted.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.