Staff/Principal Package R&D Engineer

Job Title

Staff/Principal Package R&D Engineer

Role Summary

Senior technical lead responsible for package architecture and performance of semiconductor products. Member of a European R&D team working with global development, production partners and OSATs to deliver robust package solutions.

Primary duties include technical leadership of package design and simulation, first-level onsite technical support, small project leadership, and providing package expertise across business functions.

Experience Level

Senior-level (Staff/Principal). The posting does not list required years of experience; this level typically implies extensive industry experience (commonly 7+ years).

Responsibilities

Key responsibilities include:

• Act as Package Architect with overall responsibility for package functionality and performance.
• Provide technical first-level support onsite and support OSAT partners.
• Lead small technical projects and coordinate with global package and assembly development community.
• Collect customer technical requirements, monitor market trends and benchmark competitor solutions.
• Propose and develop innovative package solutions; support business group functions with package expertise.
• Collaborate within a multicultural R&D team and with internal/external production partners.
• Occasional travel to other company sites and OSAT locations (moderate travel required).

Requirements

Must-have and preferred skills:

• Must-have: Strong leadership, proactive mindset, and proven technical leadership ability.
• Must-have: Strong architectural thinking, critical judgement, and structured problem-solving skills.
• Must-have: Excellent verbal and written communication; ability to work effectively in global, intercultural teams.
• Must-have: Energetic, result-driven attitude with ambition for a technical career path.
• Must-have: Fluent business English.
• Nice-to-have: Mandarin language skills.
• Nice-to-have: Experience with thermomechanical simulation or related simulation tools.
• Work conditions: Willingness to travel moderately for site and OSAT support.

Education Requirements

Master's degree or PhD in Semiconductor Packaging, Chemistry, Physics, Materials Technology, Mechanical Engineering, or a closely related field ("or similar" stated). No certifications or alternative-equivalent-experience language explicitly provided.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.