Staff/Principal Engineer, APTD CEM - Advanced Packaging Integration Engineering

Job Title

Staff/Principal Engineer, Advanced Packaging Integration Engineering (APTD CEM)

Role Summary

Lead development and transfer-to-manufacturing of advanced packaging technologies for high-performance memory products, focusing on performance, cost, manufacturability, quality, reliability and schedule.

Work cross-functionally to identify yield and quality improvements, enable new integration flows, and provide technical documentation for product handoff to high-volume manufacturing.

Experience Level

Senior - typically requires PhD + ≥2 years, Master's + ≥5 years, or Bachelor's + ≥7 years of relevant experience (see Education Requirements for details).

Responsibilities

Main duties include technology development, yield and quality improvements, and cross-team integration and transfer activities.

• Develop and enable advanced package technology for post-fab wafer finish and assembly processes.
• Drive yield improvements through silicon-package integration innovations and data-driven recommendations for layout, design, and process.
• Collect and analyze process and test data to produce actionable outcomes for yield and quality.
• Ensure quality via process measurement, inspection, testing and advanced process controls.
• Integrate semiconductor processes with product and process engineering teams and coordinate transitions from development to high-volume production.
• Prepare Process of Record (POR) and Model of Record (MOR) documentation for production transfer.
• Collaborate with Probe, Yield Analysis, Test, PWF, Assembly, Front-End Fab, Assembly/Test, Product Engineering, and Global Quality teams and external partners.
• Apply AI-assisted tools and insights to improve efficiency, analysis, and decision-making within organizational and legal standards.

Requirements

Required technical abilities, tools experience, and soft skills for successful performance in this role.

• Semiconductor process integration experience for post-fab wafer finish and assembly processes.
• Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
• Strong data analytics skills for SPC, DOE, defect analysis, and dashboarding.
• Deep understanding of process flows, process interactions, and integration with product engineering.
• Strong analytical and problem-solving skills; demonstrated leadership and stakeholder-management capabilities.
• Ability to work independently and collaboratively across functions in a fast-paced environment.
• Digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively.

Education Requirements

PhD with ≥2 years relevant experience, or Master’s degree with ≥5 years, or Bachelor’s degree with ≥7 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related technical field - or equivalent practical experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.