Staff Packaging Engineer

Job Title

Staff Packaging Engineer

Role Summary

Develop and qualify semiconductor package assembly and interconnect solutions focused on power SiP/modules, flip-chip LGA, multi-chip modules and power device packaging. Collaborate with OSAT/CM, Product, Reliability, Quality and Operations teams to run experiments, set process specifications and transfer designs into production.

Work addresses packaging requirements for high-density, high-reliability and high-thermal-dissipation markets such as AI/HPC, server VR and accelerators.

Experience Level

Senior - 5–15 years of relevant experience in package development and process integration.

Responsibilities

Key responsibilities include:

• Design and develop package and interconnect methods for power SiP/modules, flip-chip, leadframe and multi-chip module packaging.
• Plan and execute DOEs with OSAT/CM to optimize processes and establish process specifications.
• Coordinate with Product and Reliability teams to qualify new packages and meet schedule targets.
• Ensure smooth production transfer by resolving process integration issues and establishing production controls and monitors.
• Maintain technical expertise on advanced packaging technologies and manufacturing methods.
• Investigate and resolve internal and external customer complaints, working with Marketing, Product, Quality and Operations teams.

Requirements

Must-have skills and experience:

• 5–15 years experience in package development with emphasis on leadframe, laminate, power QFN/SiP/module and flip-chip packaging.
• Practical knowledge of semiconductor power device assembly processes, materials and related manufacturing methods (wafer front-side/back-side metallization, wire-bonding, flip chip, MCM).
• Experience with DOE execution, process optimization and production transfer activities.
• Familiarity with SPC and statistical analysis for process control.
• Proficient with AutoCAD and common office tools (Excel, PowerPoint, Word).
• Strong interpersonal, communication, analytical and presentation skills; able to work cross-functionally and with external manufacturing partners.

Education Requirements

Master's or Bachelor's degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.