Staff Packaging Engineer

Job Title

Staff Packaging Engineer

Role Summary

Qualcomm China seeks a Staff Packaging Engineer to support IC packaging quality, product development and advanced packaging applications. The role provides customer-facing troubleshooting, failure analysis lab support, and technical guidance for package launch and manufacturing.

The engineer will work with internal teams and external suppliers to triage packaging/SMT issues, support HVM launches, perform FA and reliability assessments, and publish process recommendations.

Experience Level

Senior level. The posting expects experienced candidates (typically 5+ years in SMT/BLR and package technology development). Degree-based minimums are specified under Education Requirements.

Responsibilities

Primary responsibilities include customer support, laboratory failure analysis, and enabling reliable package manufacturing.

• Triage customer packaging and SMT/BLR quality issues and perform root-cause isolation.
• Support board-level reliability (BLR) qualification and SMT process concerns.
• Drive product launch into high-volume manufacturing and perform DFM reviews.
• Define and execute failure analysis (FA) plans; produce FA reports.
• Supervise daily FA lab operations and support technicians.
• Provide process recommendations, application notes, and technology-spec compliance reviews.
• Collaborate with quality, design, NPI, modeling teams and interface with suppliers and equipment vendors.
• Manage projects/cases; perform statistical analysis including DOE; conduct industrial benchmarking.
• Support and evaluate advanced packaging technologies (BGA, CSP, WLP, FO-WLP, PoP, LGA, SiP modules).

Requirements

Must-have technical skills, work authorization, and language abilities.

• Fluent in Mandarin with functional proficiency in English.
• Authorized to work in mainland China and available for overseas travel.
• Minimum of five years' experience in SMT/BLR and package technology development.
• Strong written and oral communication skills.
• Working knowledge of package assembly processes and surface mount technology.
• Experience with package reliability testing, failure modes, underfill and rework, and high-temperature warpage analysis.
• Familiarity with package material analysis, mechanical failure analysis techniques, and failure analysis tools (microscopy, Shadow Moiré, X-ray, CSAM, EDX, IR).
• Knowledge of IPC, JEDEC, and other industry specifications.
• Nice-to-have: independent decision making, experience with portable consumer or automotive products, and direct manufacturing experience with package assembly or SMT.

Education Requirements

Bachelor's, Master's or PhD in Chemical, Electrical, Mechanical Engineering or a related field are acceptable with corresponding experience: Bachelor's +4 years, Master's +3 years, or PhD +2 years of system/package design or technology engineering experience. (Degrees and associated minimums are listed in the posting.)

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.