Staff Packaging Design Engineer (Power Modules)

Job Title

Staff Packaging Design Engineer (Power Modules)

Role Summary

Design and develop plastic power module packages using embedded die laminate technology and SMT components for commercial and industrial power device applications, including servers and AI. Partner with product design, reliability teams and OSATs to define technologies, qualify materials and processes, and deliver qualified packages on schedule.

Experience Level

Senior - 5 to 12 years of relevant package development experience.

Responsibilities

Primary responsibilities include package design, qualification, and supplier/process development.

• Design detailed power module package drawings and define tooling/specifications using AutoCAD.
• Develop and qualify package technologies and assembly processes for plastic power modules.
• Benchmark, select and qualify materials, processes and OSAT subcontractors.
• Plan and run DOE with OSATs to optimize processes and establish process specifications.
• Collaborate with product engineering and reliability teams to meet qualification schedules.
• Establish SPC and statistical controls for manufacturing processes.
• Maintain technical expertise and contribute to the packaging roadmap and its execution.

Requirements

Must-have technical skills and experience. Education requirements are listed separately below.

• 5–12 years' experience in power module plastic package development or equivalent.
• Practical understanding of semiconductor power module assembly processes, materials and technologies.
• Experience working with OSATs and running DOE to optimize assembly/processes.
• Proficiency with AutoCAD and common office tools (Excel, PowerPoint, Word).
• Knowledge of wire-bonding, flip-chip, SMT processes, SPC and statistical analysis.
• Strong interpersonal, communication, analytical and presentation skills.
• Experience qualifying materials, processes and suppliers for commercial/industrial applications (servers/AI) - preferred.

Education Requirements

Doctorate, Master’s, or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.