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Staff Packaging Design Engineer

Arm
July 31, 2026
Full-time
On-site
Cambridge, ENG, United Kingdom
Physical Design Jobs, Level - Senior

Job Title

Staff Packaging Design Engineer

Role Summary

The Staff Packaging Design Engineer will design and verify advanced System-in-Package (SiP) solutions, focusing on multichip 2.xD and 3D approaches. The role is part of the System-in-Package Integration team and works cross-functionally with IP, SoC design, package design, signal/power integrity, systems teams, and external technology partners.

Primary responsibilities include defining package architectures, producing detailed drawings, and ensuring designs meet performance and power-delivery targets.

Experience Level

Senior (Staff). The posting requests extensive package design experience; no specific years-of-experience were listed.

Responsibilities

The engineer will lead package design activities across the product development cycle and collaborate with global teams.

  • Define, draw, and verify System-in-Package (SiP) designs for multichip solutions.
  • Develop and optimise power delivery techniques and interfaces for advanced packages.
  • Provide inputs and constraints to digital designers (P&R) and collaborate with SI/PI engineers.
  • Coordinate with internal teams and external technology partners across France, US, UK and other locations.
  • Apply 2.xD and 3D packaging approaches to optimise performance.
  • Work effectively with loosely defined problems and adapt to evolving technical requirements.

Requirements

Must-have skills and experience required for successful performance.

  • Extensive experience in package design and verification.
  • Proficient with package drawing tools such as Cadence APD, Allegro, or equivalent.
  • Proven ability to optimise packaging design methodologies.
  • Strong written and verbal communication; experience collaborating across engineering teams and time zones.
  • Ability to handle loosely defined problems and adapt to change.

Nice-to-have:

  • Understanding of signal and power integrity preferred practices.
  • Experience with 2.xD and 3D package systems.

Education Requirements

Engineering degree or equivalent practical experience; the posting allows equivalent experience in lieu of a degree. No specific fields of study were specified.


About the Company

Company: Arm

Headquarters: Cambridge, United Kingdom

ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.

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Date Posted: 2026-07-11