Staff Packaging Design Engineer
The Staff Packaging Design Engineer will design and verify advanced System-in-Package (SiP) solutions, focusing on multichip 2.xD and 3D approaches. The role is part of the System-in-Package Integration team and works cross-functionally with IP, SoC design, package design, signal/power integrity, systems teams, and external technology partners.
Primary responsibilities include defining package architectures, producing detailed drawings, and ensuring designs meet performance and power-delivery targets.
Senior (Staff). The posting requests extensive package design experience; no specific years-of-experience were listed.
The engineer will lead package design activities across the product development cycle and collaborate with global teams.
Must-have skills and experience required for successful performance.
Nice-to-have:
Engineering degree or equivalent practical experience; the posting allows equivalent experience in lieu of a degree. No specific fields of study were specified.
Company: Arm
Headquarters: Cambridge, United Kingdom
ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.
