Staff Package Development Engineer

Job Title

Staff Package Development Engineer

Role Summary

The Staff Package Development Engineer develops, qualifies, and industrializes semiconductor package solutions to meet performance, reliability, manufacturability, cost, and schedule targets.

The role partners with silicon design, package design, manufacturing, reliability, quality, and OSAT suppliers to take new package technologies from concept through high-volume manufacturing.

Experience Level

Senior (Staff level). Typical experience: 5+ years in semiconductor package development; see Education Requirements for degree-based experience expectations.

Responsibilities

Lead technical activities required to develop and transfer semiconductor packages into production and to qualify them for product use.

• Define package architectures and manufacturing/process flows to meet product requirements.
• Develop and execute qualification plans, design of experiments (DOE), and statistical analysis to validate process changes.
• Work with OSATs and internal manufacturing teams to industrialize new package technologies and support scale-up to high-volume manufacturing.
• Coordinate reliability testing, failure analysis, root-cause investigations, and corrective actions.
• Drive manufacturability, cost optimization, and supplier management activities.
• Manage schedules, risks, and cross-functional communication for package development projects.
• Document results, produce technical reports, and present findings to stakeholders.

Requirements

Must-have technical skills and experience for successful performance in this role.

• Minimum 5+ years of experience in semiconductor package development, package integration, or advanced packaging technologies.
• Strong knowledge of semiconductor assembly and packaging processes: wafer backgrind; wafer dicing; die attach; flip-chip assembly; wire bonding; underfill; encapsulation/molding; ball attach; package singulation; surface-mount technology (SMT).
• Experience developing and qualifying packages in collaboration with OSAT partners.
• Experience with DOE, statistical analysis, and structured problem-solving methods.
• Experience conducting package reliability testing and performing failure analysis and root-cause investigations.
• Strong analytical, project management, and technical communication skills; ability to work independently and in global cross-functional teams.

Preferred (nice-to-have):

• Experience with advanced packaging technologies such as flip-chip CSP (FCCSP), system-in-package (SiP), fan-out (FOPLP/FOWLP), wafer-level packaging (WLP/WLCSP), and 2.5D/3D packaging.
• Knowledge of thermal, mechanical, and electrical package characterization techniques.
• Experience supporting automotive-grade product qualification and reliability standards.
• Familiarity with sustainability considerations in packaging materials selection and cost-optimization techniques.

Education Requirements

Degree expectations: Bachelor's degree in Packaging Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical discipline; Master's or Ph.D. preferred for advanced roles. Education-to-experience guidance provided by the employer: Ph.D. with 2+ years relevant industry experience; Master's with 5+ years; Bachelor's with 7+ years.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.